Patents Assigned to Hwo Young Park
  • Patent number: 4903840
    Abstract: A method of manufacturing adhesively-securable, fingernail coatings and an adhesively-securable fingernail covering product, too. The nail polish-like material is provided in semi-solid form on a sheet of adhesive-backed peel-off paper, which, when removed, exposes the adhesive of the fingernail coatings. The fingernail coatings are, after removal from a substantially air-tight package, cut into individual sections, located on the fingernails and pressed onto the fingernails to secure them there, temporarily, i.e., until they are desirably removed. The edges can then be cut to the length and width, as well as the curvature of the nail on which they are placed. The semi-solid nail enamel product is originally sealed in an air tight envelope to ensure that the coatings do not fully dry out during shipping and storage.
    Type: Grant
    Filed: May 27, 1988
    Date of Patent: February 27, 1990
    Assignee: Hwo Young Park
    Inventor: Dae S. So