Abstract: A device for solid state joining of light metals like aluminum is described. The device utilizes the principle of continuous extrusion to add a string of filler metal into a groove separating the components to be joined, and shear deformation for surface oxide removal in the groove. The device comprises a rotating drive spindle (13) terminated in a drive spindle head (14). A groove with the shape of a circular arc constituting an extrusion chamber (16) is machined in the outer surface (15) of the drive spindle head (14), the extrusion chamber (16) being limited radially outwards by a stationary annular metal shoe (17) surrounding the drive spindle head (14), the extrusion chamber (16) being terminated by an integrated (fixed) or replaceable abutment member (18) for diverting aluminum from its circular movement in the extrusion chamber (16) through a die orifice (19).

Abstract: A dynamic force measurement system for taking a series of force measurements of a force applied against a sensor device whereby to determine, record, display and store the sequence of force measurements. The sensor device is adapted to respond to said force and provide an electronic force signal which is representative thereof. The dynamic force measurement system includes a central processing unit for operating a computer program, having data and program instruction storage means, graphic display and user interface means. A sensor interface device provides for the connecting of the sensor device to the central processing unit. The sensor interface device includes means for monitoring the force signal generated by the sensor device, converting the signal to a numerical binary format for recording in intermediate storage means within the sensor interface device for ultimate transfer to the central processing unit for display, statistical analysis and storage.

Abstract: A method and apparatus are disclosed for bonding a semiconductor die to a semiconductor circuit package base with silver glass paste. Consistent and uniform bond thickness is achieved by first positioning the die so that it is in contact with the package base and recording this position, then offsetting the position of the die a measured distance from the recorded position using a micrometer.