Abstract: A conduction-cooled enclosure comprises a card guide having a card guide channel, at least one controlled-volume cavity in the card guide channel, and a thermal interface material (TIM) in the at least one controlled-volume cavity.

Abstract: A card cage configured to hold a set of electronics cards comprises a set of walls having an input and an output and a set of flow paths formed in the set of walls to enable a fluid to flow therein. The set of flow paths includes a first flow path formed between the input and the output and in first wall from the set of walls and a second flow path formed between the input and the output and in a second wall from the set of walls. The first flow path and the second flow path are substantially the same length and a fluid flowing therein experiences substantially the same pressure drop.

Abstract: A card cage configured to hold a set of electronics cards comprises a set of walls having an input and an output and a set of flow paths formed in the set of walls to enable a fluid to flow therein. The set of flow paths includes a first flow path formed between the input and the output and in first wall from the set of walls and a second flow path formed between the input and the output and in a second wall from the set of walls. The first flow path and the second flow path are substantially the same length and a fluid flowing therein experiences substantially the same pressure drop.

Abstract: In a backplane interconnect configuration for use in a high-speed data processing system, a plurality of connector slots include an array of connector terminals. First conductive traces electrically couple at least two terminals of adjacent slots, the terminals being coupled by the first conductive traces to form multiple clusters. Each of the plurality of the clusters are in turn electrically coupled by separate conductive traces to at least one common node. This configuration allows for a reduction in the propagation delay of signals propagating between connector slots.

Abstract: A card guide which optimizes the flow of forced cooling air, provides for self alignment to a host motherboard and provides for integrated ESD hazard mitigation, includes an elongated body having a groove disposed along a longitudinal axis of the body. The groove is adapted for receiving the edge of an inserted daughter card. The card guide further includes integral, arcuate inner and outer deflectors, which form a channel for redirecting incident air flow toward regions of the daughter card which would otherwise be blocked from the air flow. The end of the card guide that receives the daughter card houses an ESD clip. The ESD clip functions to dissipate static charge accumulated on the daughter card from a conductive strip disposed along the edge of the daughter card. The ESD clip further serves to dissipate accumulated static charge from a front panel attached to the daughter card, via a guide pin fixedly attached to the front panel.

Abstract: A card guide which optimizes the flow of forced cooling air, provides for self alignment to a host motherboard and provides for integrated electro-static discharge (ESD) hazard mitigation. includes an elongated body having a groove disposed along a longitudinal axis of the body. The groove is adapted for receiving the edge of an inserted daughter card. The card guide further includes integral, arcuate inner and outer deflectors, which form a channel for redirecting incident air flow toward regions of the daughter card which would otherwise be blocked from the air flow. Extension deflector assemblies may be situated between card guides to extend the inner and outer deflectors so as to minimize air flow discontinuities in regions between daughter card positions. The end of the card guide that receives the daughter card houses an ESD clip. The ESD clip functions to dissipate static charge accumulated on the daughter card from a conductive strip disposed along the edge of the daughter card.

Abstract: A modular card cage allows for improved access to the rear panel of a backplane, while providing for enhanced EMI shielding. First and second side panels, in combination with top and bottom covers, form the card cage. The top and bottom covers are adapted for removably mounting to the side panels, and, when mounted, provide lateral rigidity to the card cage. At least one of the top and bottom covers comprises a front portion and a rear portion. The front portion of the cover is preferably separable from the rear portion such that one of the front and rear portions is removable from the side panels, while the other of the front and rear portions remains mounted for providing lateral rigidity. EMI shielding is provided in all portions of the cage, including the removably mounted covers, preferably by means of embedded, continuous gasketing.

Abstract: In a method and apparatus for partitioning and packaging a power generation and distribution system, a plurality of power supply modules are distributed along the length of the backplane such that backplane voltage drops are minimized and such that power supply currents flow essentially orthogonal to the signal connections between the backplane slots. In this manner, signal interference is minimized and the need for bus bars on the backplane are substantially reduced or eliminated.

Abstract: In an improved connector assembly, a male pin (112) is inserted into a proximal end of a female contact which (110) conductivity engages the pin at a distal end, providing a folded signal path geometry. As a signal propagates in a first direction alone the male pin (112), it generates a first magnetic field of a first orientation about the male pin (112). At the contact point, the signal reverses direction and generates a second magnetic field of a second orientation opposite the first orientation about the female contact (110). Their respective opposed orientations cause the magnetic fields to substantially cancel in the region of magnetic interaction. Any remaining electronic fields are contained by grounded shielding in the female contact (110) cavities, for example in the form of chambers with conductivity coated walls surrounding the contacts. This configuration mitigates the effect of crosstalk between adjacent signals in the connector, and reduces the effective path length of the signal.

Abstract: A backplane stiffener mounts in a channel defined between parallel rows of connectors on a backplane. In a first embodiment, the stiffener has a substantially U-shaped cross section and has a maximum width less than the width of the channel. The sidewalls are parallel and linear throughout the length of the stiffener. A second embodiment is adapted for use in "dog-legged" connector channels wherein at least one of the connectors in the row is wider than or spatially offset from the remaining connectors. The stiffener is preferably formed from a sheet of pliable material, for example sheet metal which is manipulated to form various features and folded longitudinally to form a rigid member. Rigidity is enhanced in an economic manner which does not interfere with backplane operations.

Abstract: A current regulating, transconductance amplifier is connected to the load capacitor of a backplane system. The load capacitor is connected close to the load inside the feedback loop of the regulating amplifier. The frequency response shaping networks of the amplifier are designed to include the pole and zero, contributed by this capacitor, to meet the criteria for fast settling of a current step at the load.

Abstract: A card cage for holding a plurality of printed circuit boards has aerodynamically designed card guides and air deflectors that are configured to direct air flow across components mounted on the printed circuit boards. The card cage has a substantially rectangular frame formed by a pair of side panels, a pair of upper cross members and a pair of lower cross members. A pair of upper card guides are mounted between the upper cross members and a pair of lower card guides are mounted between the lower cross members, the card guides being captively held in parallel relationship to the side panels. The inner facing surface of each card guide is provided with a U-shaped channel that is sized and shaped to slidably receive a printed circuit card. The sidewalls of each card guide taper inwardly from the inner facing surface to the outer facing surface to form a streamlined structure with a narrow head at the outer surface that provides minimum resistance to air flow through the card cage.