Patents Assigned to Hydrocool Pty Limited
  • Patent number: 6446442
    Abstract: A heat exchanger 17 for an electronic heat pump 11 includes a thermally conductive base plate 18 having first and second surfaces, the first surface being flat and adapted to make intimate surface contact with a surface of the electronic heat pump and the second surface being obverse to the first surface and supporting an array of thermally conductive fins 21. The adjacent fins 21 define there between a plurality of micro channels.
    Type: Grant
    Filed: July 31, 2001
    Date of Patent: September 10, 2002
    Assignee: Hydrocool Pty Limited
    Inventors: Andrew W. Batchelor, Ben Banney, David McDonald, Tilak T. Chandratilleke
  • Patent number: 5822993
    Abstract: A thermoelectric system (10) having a thermoelectric module (12) having first and second opposed outer faces, that first outer face being relatively cool and the second outer face being relatively hot in use, a manifold (22) defining a volume being attached to at least one outer facts of the thermoelectric module (12), the manifold (22) having a liquid inlet (30) and a liquid outlet (32) so that, in use, liquid flows through the manifold (22) wherein the manifold (22) contains a non-static means such as an impeller (40) for increasing turbulence in the liquid flowing therethrough so as to increase efficiency of heat transfer between the thermoelectric module (12) and the liquid.
    Type: Grant
    Filed: November 13, 1996
    Date of Patent: October 20, 1998
    Assignee: Hydrocool Pty Limited
    Inventor: Graeme Scott Attey