Abstract: A heat exchanger 17 for an electronic heat pump 11 includes a thermally conductive base plate 18 having first and second surfaces, the first surface being flat and adapted to make intimate surface contact with a surface of the electronic heat pump and the second surface being obverse to the first surface and supporting an array of thermally conductive fins 21. The adjacent fins 21 define there between a plurality of micro channels.
Type:
Grant
Filed:
July 26, 2002
Date of Patent:
September 16, 2003
Assignee:
Hydrocool Pyt, Limited
Inventors:
Andrew W. Batchelor, Ben Banney, David McDonald, Tilak T. Chandratilleke