Patents Assigned to Hyndai Electronics America
  • Word line driver for semiconductor memories
    Patent number: 5875149
    Abstract: A hierarchical word line driving structure is disclosed that uses a single global word line and low power sub-word line driver circuits that are relatively small in size. Higher density memory cell arrays are made possible by inverting the signal on a global word line inside each sub-word line driver circuit.
    Type: Grant
    Filed: February 6, 1997
    Date of Patent: February 23, 1999
    Assignee: Hyndai Electronics America
    Inventors: Jong-Hoon Oh, Joon-Ho Kim, Jinyong Chung