Patents Assigned to HyQ Research Solutions, LLC
  • Publication number: 20210407736
    Abstract: A dielectric assembly solid dielectric elements within a liquid or solid matrix material. The dielectric assembly may be manufactured by pressing a dielectric powder to form pressed dielectric elements, sintering the pressed dielectric elements to form the solid dielectric elements, and assembling the solid dielectric elements within the matrix material to form the dielectric assembly. The solid dielectric elements can be specifically oriented (e.g., in one or more tiled layers) or randomly oriented, and the dielectric assemblies can be molded and/or machined into desired 3D geometries. The dielectric assemblies can be relatively large (e.g., >1 mm3) while having bulk dielectric constants higher than conventional slurries and composites formed of dielectric powder in a liquid or solid matrix.
    Type: Application
    Filed: June 29, 2021
    Publication date: December 30, 2021
    Applicant: HyQ Research Solutions, LLC
    Inventors: Matthew Lanagan, Sebastian Rupprecht