Patents Assigned to Hysitron, Inc.
  • Patent number: 9902027
    Abstract: An instrument changing assembly includes a magazine having one or more probe assembly stations. The assembly further includes at least one probe change tool including a receptacle socket. One or more probe assemblies are retained within the one or more probe assembly stations. The one or more probe assemblies each include a probe receptacle including a probe retention recess and a common socket fitting configured for complementary fitting with a common receptacle socket. The probe change tool is configured to install or extract the respective probes from a mechanical testing instrument according to the complementary fit between the common socket fitting and the common receptacle socket of the probe assemblies. Alternatively, the instrument changing assembly includes an instrument array housing including a plurality of instruments. Each of the one or more instruments (probe and transducer combination) are deployed relative to the instrument array housing with an instrument deployment actuator.
    Type: Grant
    Filed: August 1, 2014
    Date of Patent: February 27, 2018
    Assignee: Hysitron, Inc.
    Inventors: Rajiv Dama, Svetlana Zigelman
  • Patent number: 9829417
    Abstract: An environmental conditioning assembly for use in mechanical testing at scales of microns or less. The assembly includes an enclosure housing with an environmental cavity therein. A sample stage is positioned within the environmental cavity and includes an option sample heater. The enclosure housing includes a cavity perimeter clustered around the sample stage, and the enclosure housing isolates the environmental cavity and the sample stage from an environment exterior to the enclosure housing. In an example, an expansion and contraction linkage maintains a sample on the sample stage at a static elevation according to heating or cooling fluctuations within the environmental cavity. A testing instrument access port extends through the enclosure housing into the environmental cavity.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: November 28, 2017
    Assignee: Hysitron, Inc.
    Inventors: Roger William Schmitz, Ude D. Hangen, Lucas Paul Keranen, Ryan Major, Yunje Oh, Jeremiah Vieregge, Christopher David Young
  • Patent number: 9804072
    Abstract: A heating system for use in mechanical testing at scales of microns or less includes a stage heater. The stage heater having a stage plane, and a stage heating element distributed across the stage plane. Two or more support mounts are on opposed sides of the stage plane. A first bridge extends from the stage plane to a first mount of the two or more support mounts, and a second bridge extends from the stage plane to a second mount of the two or more support mounts. The first and second bridges provide a plurality of supports between the stage plane and two or more support mounts to accordingly support the stage plane. In another example, the heating system includes a probe heater configured to heat a probe as part of mechanical testing.
    Type: Grant
    Filed: November 28, 2012
    Date of Patent: October 31, 2017
    Assignee: Hysitron, Inc.
    Inventors: Syed Amanulla Syed Asif, Edward Cyrankowski, Lucas Paul Keranen, Ryan Major, Yunje Oh, Oden Lee Warren, Maciej W. Misiak
  • Patent number: 9759641
    Abstract: A sub-micron scale property testing apparatus including a test subject holder and heating assembly. The assembly includes a holder base configured to couple with a sub-micron mechanical testing instrument and electro-mechanical transducer assembly. The assembly further includes a test subject stage coupled with the holder base. The test subject stage is thermally isolated from the holder base. The test subject stage includes a stage subject surface configured to receive a test subject, and a stage plate bracing the stage subject surface. The stage plate is under the stage subject surface. The test subject stage further includes a heating element adjacent to the stage subject surface, the heating element is configured to generate heat at the stage subject surface.
    Type: Grant
    Filed: November 23, 2015
    Date of Patent: September 12, 2017
    Assignee: Hysitron, Inc.
    Inventors: Yunje Oh, Syed Amanulla Syed Asif, Edward Cyrankowski, Oden Lee Warren
  • Patent number: 9476816
    Abstract: A heating assembly configured for use in mechanical testing at a scale of microns or less. The heating assembly includes a probe tip assembly configured for coupling with a transducer of the mechanical testing system. The probe tip assembly includes a probe tip heater system having a heating element, a probe tip coupled with the probe tip heater system, and a heater socket assembly. The heater socket assembly, in one example, includes a yoke and a heater interface that form a socket within the heater socket assembly. The probe tip heater system, coupled with the probe tip, is slidably received and clamped within the socket.
    Type: Grant
    Filed: November 14, 2012
    Date of Patent: October 25, 2016
    Assignee: Hysitron, Inc.
    Inventors: Roger William Schmitz, Yunje Oh
  • Patent number: 9472374
    Abstract: A multiple degree of freedom sample stage or testing assembly including a multiple degree of freedom sample stage. The multiple degree of freedom sample stage includes a plurality of stages including linear, and one or more of rotation or tilt stages configured to position a sample in a plurality of orientations for access or observation by multiple instruments in a clustered volume that confines movement of the multiple degree of freedom sample stage. The multiple degree of freedom sample stage includes one or more clamping assemblies to statically hold the sample in place throughout observation and with the application of force to the sample, for instance by a mechanical testing instrument. Further, the multiple degree of freedom sample stage includes one or more cross roller bearing assemblies that substantially eliminate mechanical tolerance between elements of one or more stages in directions orthogonal to a moving axis of the respective stages.
    Type: Grant
    Filed: September 28, 2012
    Date of Patent: October 18, 2016
    Assignee: HYSITRON, INC.
    Inventors: Edward Cyrankowski, Syed Amanulla Syed Asif, Ryan Major, Derek Rasugu, Yuxin Feng
  • Patent number: 9404841
    Abstract: A microelectromechanical transducer and test system is disclosed. One embodiment includes a body, a probe moveable relative to the body, and a micromachined comb drive. The micromachined comb drive includes a plurality of sensing capacitors forming a differential capacitive displacement sensor, each sensing capacitor comprising a plurality of comb capacitors and each configured to provide capacitance levels which, together, are representative of a position of the probe.
    Type: Grant
    Filed: November 26, 2012
    Date of Patent: August 2, 2016
    Assignee: Hysitron, Inc.
    Inventors: Yunje Oh, Syed Amanula Syed Asif, Oden Warren
  • Patent number: 9316569
    Abstract: A sub-micron scale property testing apparatus including a test subject holder and heating assembly. The assembly includes a holder base configured to couple with a sub-micron mechanical testing instrument and electro-mechanical transducer assembly. The assembly further includes a test subject stage coupled with the holder base. The test subject stage is thermally isolated from the holder base. The test subject stage includes a stage subject surface configured to receive a test subject, and a stage plate bracing the stage subject surface. The stage plate is under the stage subject surface. The test subject stage further includes a heating element adjacent to the stage subject surface, the heating element is configured to generate heat at the stage subject surface.
    Type: Grant
    Filed: August 26, 2010
    Date of Patent: April 19, 2016
    Assignee: Hysitron, Inc.
    Inventors: Yunje Oh, Syed Amanulla Syed Asif, Edward Cyrankowski, Oden Lee Warren
  • Patent number: 9194727
    Abstract: A method of calibrating a mechanical instrument assembly includes reading a memory device coupled with a mechanical testing instrument, the mechanical testing instrument having one or more mechanical characteristics with values unique to the mechanical testing instrument, and reading includes reading of one or more calibration values based on the one or more mechanical characteristic values. The method further includes calibrating the mechanical instrument assembly according to the one or more calibration values. The mechanical testing instrument is coupled with the mechanical instrument assembly.
    Type: Grant
    Filed: November 23, 2011
    Date of Patent: November 24, 2015
    Assignee: Hysitron, Inc.
    Inventors: Christopher David Young, Daniel Paul Carlson, Lucas Paul Keranen, Jeffrey P. Schirer
  • Publication number: 20150185117
    Abstract: An environmental conditioning assembly for use in mechanical testing at scales of microns or less. The assembly includes an enclosure housing with an environmental cavity therein. A sample stage is positioned within the environmental cavity and includes an option sample heater. The enclosure housing includes a cavity perimeter clustered around the sample stage, and the enclosure housing isolates the environmental cavity and the sample stage from an environment exterior to the enclosure housing. In an example, an expansion and contraction linkage maintains a sample on the sample stage at a static elevation according to heating or cooling fluctuations within the environmental cavity. A testing instrument access port extends through the enclosure housing into the environmental cavity.
    Type: Application
    Filed: March 14, 2013
    Publication date: July 2, 2015
    Applicant: Hysitron, Inc.
    Inventors: Roger William Schmitz, Ude D. Hangen, Lucas Paul Keranen, Ryan Major, Yunje Oh, Jeremiah Vieregge, Christopher David Young
  • Patent number: 8959980
    Abstract: An automated testing system includes systems and methods to facilitate inline production testing of samples at a micro (multiple microns) or less scale with a mechanical testing instrument. In an example, the system includes a probe changing assembly for coupling and decoupling a probe of the instrument. The probe changing assembly includes a probe change unit configured to grasp one of a plurality of probes in a probe magazine and couple one of the probes with an instrument probe receptacle. An actuator is coupled with the probe change unit, and the actuator is configured to move and align the probe change unit with the probe magazine and the instrument probe receptacle. In another example, the automated testing system includes a multiple degree of freedom stage for aligning a sample testing location with the instrument. The stage includes a sample stage and a stage actuator assembly including translational and rotational actuators.
    Type: Grant
    Filed: August 8, 2013
    Date of Patent: February 24, 2015
    Assignee: Hysitron, Inc.
    Inventors: David James Vodnick, Arpit Dwivedi, Lucas Paul Keranen, Michael David Okerlund, Roger William Schmitz, Oden Lee Warren, Christopher David Young
  • Patent number: 8939041
    Abstract: An automated testing system includes systems and methods to facilitate inline production testing of samples at a micro (multiple microns) or less scale with a mechanical testing instrument. In an example, the system includes a probe changing assembly for coupling and decoupling a probe of the instrument. The probe changing assembly includes a probe change unit configured to grasp one of a plurality of probes in a probe magazine and couple one of the probes with an instrument probe receptacle. An actuator is coupled with the probe change unit, and the actuator is configured to move and align the probe change unit with the probe magazine and the instrument probe receptacle. In another example, the automated testing system includes a multiple degree of freedom stage for aligning a sample testing location with the instrument. The stage includes a sample stage and a stage actuator assembly including translational and rotational actuators.
    Type: Grant
    Filed: February 10, 2012
    Date of Patent: January 27, 2015
    Assignee: Hysitron, Inc.
    Inventors: David James Vodnick, Arpit Dwivedi, Lucas Paul Keranen, Michael David Okerlund, Roger William Schmitz, Oden Lee Warren, Christopher David Young
  • Publication number: 20140293293
    Abstract: An automated testing system includes systems and methods to facilitate inline production testing of samples at a micro (multiple microns) or less scale with a mechanical testing instrument. In an example, the system includes a probe changing assembly for coupling and decoupling a probe of the instrument. The probe changing assembly includes a probe change unit configured to grasp one of a plurality of probes in a probe magazine and couple one of the probes with an instrument probe receptacle. An actuator is coupled with the probe change unit, and the actuator is configured to move and align the probe change unit with the probe magazine and the instrument probe receptacle. In another example, the automated testing system includes a multiple degree of freedom stage for aligning a sample testing location with the instrument. The stage includes a sample stage and a stage actuator assembly including translational and rotational actuators.
    Type: Application
    Filed: February 10, 2012
    Publication date: October 2, 2014
    Applicant: Hysitron, Inc.
    Inventors: David James Vodnick, Arpit Dwivedi, Lucas Paul Keranen, Michael David Okerlund, Roger William Schmitz, Oden Lee Warren, Christopher David Young
  • Patent number: 8844366
    Abstract: A testing instrument for mechanical testing at nano or micron scale includes a transducer body, and a coupling shaft coupled with a probe tip. A transducer body houses a capacitor. The capacitor includes first and second counter electrodes and a center electrode assembly interposed therebetween. The center electrode assembly is movable with the coupling shaft relative to the first and second counter electrodes, for instance in one or more of dimensions including laterally and normally. The center electrode assembly includes a center plate coupled with the coupling shaft and one or more springs extending from the center plate. Upper and lower plates are coupled with the center plate and cover the center plate and the one or more springs. A shaft support assembly includes one or more support elements coupled along the coupling shaft. The shaft support assembly provides lateral support to the coupling shaft.
    Type: Grant
    Filed: March 9, 2012
    Date of Patent: September 30, 2014
    Assignee: Hysitron, Inc.
    Inventors: Oden Lee Warren, Syed Amanulla Syed Asif, Yunje Oh, Yuxin Feng, Edward Cyrankowski, Ryan Major
  • Publication number: 20140231670
    Abstract: A multiple degree of freedom sample stage or testing assembly including a multiple degree of freedom sample stage. The multiple degree of freedom sample stage includes a plurality of stages including linear, and one or more of rotation or tilt stages configured to position a sample in a plurality of orientations for access or observation by multiple instruments in a clustered volume that confines movement of the multiple degree of freedom sample stage. The multiple degree of freedom sample stage includes one or more clamping assemblies to statically hold the sample in place throughout observation and with the application of force to the sample, for instance by a mechanical testing instrument. Further, the multiple degree of freedom sample stage includes one or more cross roller bearing assemblies that substantially eliminate mechanical tolerance between elements of one or more stages in directions orthogonal to a moving axis of the respective stages.
    Type: Application
    Filed: September 28, 2012
    Publication date: August 21, 2014
    Applicant: Hysitron, Inc.
    Inventors: Edward Cyrankowski, Syed Amanulla Syed Asif, Ryan Major, Derek Rasugu, Yuxin Feng
  • Patent number: 8770036
    Abstract: An automated testing system includes systems and methods to facilitate inline production testing of samples at a micro (multiple microns) or less scale with a mechanical testing instrument. In an example, the system includes a probe changing assembly for coupling and decoupling a probe of the instrument. The probe changing assembly includes a probe change unit configured to grasp one of a plurality of probes in a probe magazine and couple one of the probes with an instrument probe receptacle. An actuator is coupled with the probe change unit, and the actuator is configured to move and align the probe change unit with the probe magazine and the instrument probe receptacle. In another example, the automated testing system includes a multiple degree of freedom stage for aligning a sample testing location with the instrument. The stage includes a sample stage and a stage actuator assembly including translational and rotational actuators.
    Type: Grant
    Filed: August 8, 2013
    Date of Patent: July 8, 2014
    Assignee: Hysitron, Inc.
    Inventors: David James Vodnick, Arpit Dwivedi, Lucas Paul Keranen, Michael David Okerlund, Roger William Schmitz, Oden Lee Warren, Christopher David Young
  • Publication number: 20140150562
    Abstract: A testing instrument for mechanical testing at nano or micron scale includes a transducer body, and a coupling shaft coupled with a probe tip. A transducer body houses a capacitor. The capacitor includes first and second counter electrodes and a center electrode assembly interposed therebetween. The center electrode assembly is movable with the coupling shaft relative to the first and second counter electrodes, for instance in one or more of dimensions including laterally and normally. The center electrode assembly includes a center plate coupled with the coupling shaft and one or more springs extending from the center plate. Upper and lower plates are coupled with the center plate and cover the center plate and the one or more springs. A shaft support assembly includes one or more support elements coupled along the coupling shaft. The shaft support assembly provides lateral support to the coupling shaft.
    Type: Application
    Filed: March 9, 2012
    Publication date: June 5, 2014
    Applicant: Hysitron, Inc.
    Inventors: Oden Lee Warren, Syed Amanulla Syed Asif, Yunje Oh, Yuxin Feng, Edward Cyrankowski, Ryan Major
  • Patent number: 8631687
    Abstract: An indentation assembly for sub-micron testing includes an indentation tip and a tip holder coupled with the indentation tip. The tip holder includes a first thermal conductivity and a first coefficient of thermal expansion. A tip holder mount configured for coupling with a transducer and the tip holder, the tip holder mount having a second thermal conductivity greater than the first thermal conductivity, and the tip holder mount has a second coefficient of thermal expansion greater than the first coefficient of thermal expansion. The tip holder mount has a mount length, and the tip holder further has a tip holder length greater that the mount length. The tip holder remotely positions the tip holder mount relative to the indentation tip. The tip holder length, volume and the first thermal conductivity cooperate to throttle heat transfer through the tip holder prior to reaching the tip holder mount.
    Type: Grant
    Filed: April 19, 2011
    Date of Patent: January 21, 2014
    Assignee: Hysitron, Inc.
    Inventors: Justin D. Patten, Christopher David Young, Lucas Paul Keranen
  • Publication number: 20130319127
    Abstract: An automated testing system includes systems and methods to facilitate inline production testing of samples at a micro (multiple microns) or less scale with a mechanical testing instrument. In an example, the system includes a probe changing assembly for coupling and decoupling a probe of the instrument. The probe changing assembly includes a probe change unit configured to grasp one of a plurality of probes in a probe magazine and couple one of the probes with an instrument probe receptacle. An actuator is coupled with the probe change unit, and the actuator is configured to move and align the probe change unit with the probe magazine and the instrument probe receptacle. In another example, the automated testing system includes a multiple degree of freedom stage for aligning a sample testing location with the instrument. The stage includes a sample stage and a stage actuator assembly including translational and rotational actuators.
    Type: Application
    Filed: August 8, 2013
    Publication date: December 5, 2013
    Applicant: Hysitron, Inc.
    Inventors: David James Vodnick, Arpit Dwivedi, Lucas Paul Keranen, Michael David Okerlund, Roger William Schmitz, Oden Lee Warren, Christopher David Young
  • Publication number: 20130319071
    Abstract: An automated testing system includes systems and methods to facilitate inline production testing of samples at a micro (multiple microns) or less scale with a mechanical testing instrument. In an example, the system includes a probe changing assembly for coupling and decoupling a probe of the instrument. The probe changing assembly includes a probe change unit configured to grasp one of a plurality of probes in a probe magazine and couple one of the probes with an instrument probe receptacle. An actuator is coupled with the probe change unit, and the actuator is configured to move and align the probe change unit with the probe magazine and the instrument probe receptacle. In another example, the automated testing system includes a multiple degree of freedom stage for aligning a sample testing location with the instrument. The stage includes a sample stage and a stage actuator assembly including translational and rotational actuators.
    Type: Application
    Filed: August 8, 2013
    Publication date: December 5, 2013
    Applicant: Hysitron, Inc.
    Inventors: David James Vodnick, Arpit Dwivedi, Lucas Paul Keranen, Michael David Okerlund, Roger William Schmitz, Oden Lee Warren, Christopher David Young