Patents Assigned to Hytek Microsystems Incorporated
  • Method of making a heat dissipating assembly
    Patent number: 4738024
    Abstract: A heat dissipating assembly for solid state component and control circuitry therefor including a first printed circuit board [45] having a printed circuit thereon for making connections with electronic components [47], fixing the components to the first circuit board, bending the conductors [49] attached to the components to receive a second circuit board [52] that includes control circuitry for the components, and assembling the joined boards into a housing [40].
    Type: Grant
    Filed: August 24, 1987
    Date of Patent: April 19, 1988
    Assignee: Hytek Microsystems Incorporated
    Inventor: Noel H. Eberhardt