Abstract: There is disclosed a test circuit for a flash memory device and method thereof, which comprises a byte program means for performing a byte program according to a byte program enable signal and a cell address signal and outputting the last address signal of a sector, a program fail signal and an address signal of the fail cell; a chip erase means for performing a chip erase operation according to an erase enable signal and said sector address signal and for outputting an erase fail signal and an address signal of a fail sector; a sector address increment means for increasing a sector address according to said sector address signal and outputting the last sector address signal; a first means for generating a test signal according to the test enable signal, said last sector address signal, a test erase enable signal, said program fail signal and said erase fail signal; a second means for generating a test program enable signal or a test erase enable signal according to the last sector address signal and the test

Abstract: A method for manufacturing a semiconductor device improves hot carrier characteristic in a device having a thick gate insulating film without being affected by short channel effect, thereby improving reliability of the device. The method for manufacturing a semiconductor device includes the steps of forming gate electrodes having gate insulating films of different thicknesses on a semiconductor substrate, implanting a low-concentration impurity ion into the semiconductor substrate at both sides of the gate electrodes, implanting a nitrogen ion into a portion, where the low-concentration impurity ion is implanted, in the gate insulating film relatively thicker than the other gate insulating film, forming sidewall spacers at both sides of the gate electrodes, and implanting a high-concentration source/drain impurity ion into the semiconductor substrate.