Patents Assigned to I&A SYSTEM Co., Ltd.
  • Publication number: 20130062017
    Abstract: Provided is a direct heating type card lamination apparatus, and more particularly, to a direct heating type card lamination apparatus with a concise and simple structure that performs low power lamination by applying heat directly on a card and performs lamination conveniently and quickly without a waiting time. The direct heating type card lamination apparatus does not perform lamination by a heated roller after heating the roller with a heating element according to a conventional method but performs lamination by directly applying heat on a card by a momentarily heated lamination head. Accordingly, the direct heating type card lamination apparatus quickly and conveniently performs lamination with low power without energy loss or a waiting time.
    Type: Application
    Filed: March 8, 2012
    Publication date: March 14, 2013
    Applicant: I&A SYSTEM Co., Ltd.
    Inventor: Changbum KIM