Patents Assigned to i2C Solutions, LLC
  • Thermal ground planes and light-emitting diodes
    Patent number: 9374904
    Abstract: Methods and systems for thermal management of one or more LEDs are disclosed. One or more LEDs may be coupled with an external layer of a thermal ground plane according to some embodiments described herein. For example, the one or more LEDs may be electrically coupled with a circuit carrier with one or more electrically conductive traces etched therein prior to coupling with the thermal ground plane. The thermal ground plane may be charged with a working fluid and/or hermetically sealed after being coupled with the LED.
    Type: Grant
    Filed: February 20, 2014
    Date of Patent: June 21, 2016
    Assignee: i2C Solutions, LLC
    Inventors: William Francis, Michael Hulse
  • THERMAL GROUND PLANES AND LIGHT-EMITTING DIODES
    Publication number: 20150200344
    Abstract: Methods and systems for thermal management of one or more LEDs are disclosed. One or more LEDs may be coupled with an external layer of a thermal ground plane according to some embodiments described herein. For example, the one or more LEDs may be electrically coupled with a circuit carrier with one or more electrically conductive traces etched therein prior to coupling with the thermal ground plane. The thermal ground plane may be charged with a working fluid and/or hermetically sealed after being coupled with the LED.
    Type: Application
    Filed: February 20, 2014
    Publication date: July 16, 2015
    Applicant: i2C Solutions, LLC
    Inventors: William Francis, Michael Hulse