Abstract: A structure and method for a circuitized substrate assembly that provides interface capability with high-density I/O devices, such as semiconductor devices, said structure and method providing enhanced capability for direct chip attach technology and for device interface board that perform functional and operational testing capability for semiconductor devices having an interconnect pitch down to 50 um or smaller.

Abstract: A circuitized substrate which utilizes at least one internal (embedded) resistor as part thereof, the resistor comprised of a material including resin and a quantity of powders of nano-particle and/or micro-particle sizes. The resistor serves to decrease the capacitance in the formed circuit while only slightly increasing the high frequency resistance, thereby improving circuit performance through the substantial elimination of some discontinuities known to exist in structures like these. An electrical assembly (substrate and at least one electrical component) is also provided.