Patents Assigned to IBM Corporation (Burlington)
  • Single reactor, multi-pressure chemical vapor deposition for semiconductor devices
    Publication number: 20050145172
    Abstract: An apparatus and method for forming at least a portion of an electronic device include a High Vacuum-Chemical Vapor Deposition (UHV-CVD) system and a Low Pressure-Chemical Vapor Deposition (LPCVD) system using a common reactor. The invention overcomes the problem, of silicon containing wafers being dipped in HF acid prior to CVD processing, and the problem of surface passivation between processes in multiple CVD reactors.
    Type: Application
    Filed: February 15, 2005
    Publication date: July 7, 2005
    Applicant: IBM Corporation (Burlington)
    Inventors: Jack Chu, Basanth Jagannathan, Ryan Wuthrich