Patents Assigned to IBM Semiconductor Research and Development Center (SRDC)
  • METHOD OF REPAIRING PROBE PADS
    Publication number: 20130072011
    Abstract: A method that includes forming a first level of active circuitry on a substrate, forming a first probe pad electrically connected to the first level of active circuitry where the first probe pad having a first surface, contacting the first probe pad with a probe tip that displaces a portion of the first probe pad above the first surface, and performing a chemical mechanical polish on the first probe pad to planarize the portion of the first probe pad above the first surface. The method also includes forming a second level of active circuitry overlying the first probe pad, forming a second probe pad electrically connected to the second level of active circuitry, contacting the second probe pad with a probe tip that displaces a portion of the probe pad, and chemically mechanically polishing the second probe pad to remove the portion displaced.
    Type: Application
    Filed: September 14, 2012
    Publication date: March 21, 2013
    Applicants: IBM SEMICONDUCTOR RESEARCH AND DEVELOPMENT CENTER (SRDC), STMICROELECTRONICS, INC.
    Inventors: John H. Zhang, Laertis Economikos, Robin Van Den Nieuwenhuizen, Wei-Tsu Tseng
  • METHOD OF REPAIRING PROBE PADS
    Publication number: 20130063173
    Abstract: A method that includes forming a first level of active circuitry on a substrate, forming a first probe pad electrically connected to the first level of active circuitry where the first probe pad having a first surface, contacting the first probe pad with a probe tip that displaces a portion of the first probe pad above the first surface, and performing a chemical mechanical polish on the first probe pad to planarize the portion of the first probe pad above the first surface. The method also includes forming a second level of active circuitry overlying the first probe pad, forming a second probe pad electrically connected to the second level of active circuitry, contacting the second probe pad with a probe tip that displaces a portion of the probe pad, and chemically mechanically polishing the second probe pad to remove the portion displaced.
    Type: Application
    Filed: September 13, 2012
    Publication date: March 14, 2013
    Applicants: IBM Semiconductor Research and Development Center (SRDC), STMicroelectronics, Inc.
    Inventors: John H. Zhang, Laertis Economikos, Robin Van Den Nieuwenhuizen, Wei-Tsu Tseng
  • METHOD OF REPAIRING PROBE PADS
    Publication number: 20110156032
    Abstract: A method that includes forming a first level of active circuitry on a substrate, forming a first probe pad electrically connected to the first level of active circuitry where the first probe pad having a first surface, contacting the first probe pad with a probe tip that displaces a portion of the first probe pad above the first surface, and performing a chemical mechanical polish on the first probe pad to planarize the portion of the first probe pad above the first surface. The method also includes forming a second level of active circuitry overlying the first probe pad, forming a second probe pad electrically connected to the second level of active circuitry, contacting the second probe pad with a probe tip that displaces a portion of the probe pad, and chemically mechanically polishing the second probe pad to remove the portion displaced.
    Type: Application
    Filed: December 31, 2009
    Publication date: June 30, 2011
    Applicants: STMICROELECTRONICS, INC., IBM Semiconductor Research and Development Center (SRDC)
    Inventors: John H. Zhang, Laertis Economikos, Robin Van Den Nieuwenhuizen, Wei-Tsu Tseng