Patents Assigned to IC Mems, Inc.
  • Probe structure for testing semiconductor devices and method for fabricating the same
    Patent number: 6724204
    Abstract: Disclosed are a probe structure for testing semiconductor devices and a method for fabricating the probe structure. The fabricated probe structure of the present invention satisfies the high density, the uniformity of size, height and spacing, and the integration of elements. The probe structure of the present invention solves the conventional problems such as long fabrication time of the probe structure, difficulty in finely controlling the structure of the probe structure, complexity of the whole process, mechanical instability of the products, and difficulty in uniformly assembling a plurality of the probe structures. Additionally, the probe structure of the present invention solves several problems caused in an actual testing step of the semiconductor devices, for instance, long testing time of the semiconductor device, difficulty in providing the sufficient contact force between the probe structure and the semiconductor device, and having to specially design the test pads of the semiconductor device.
    Type: Grant
    Filed: April 18, 2002
    Date of Patent: April 20, 2004
    Assignee: IC Mems, Inc.
    Inventors: Dong-il Cho, Sangjun Park
  • Probe structure for testing semiconductor devices and method for fabricating the same
    Publication number: 20020153911
    Abstract: Disclosed are a probe structure for testing semiconductor devices and a method for fabricating the probe structure. The fabricated probe structure of the present invention satisfies the high density, the uniformity of size, height and spacing, and the integration of elements. The probe structure of the present invention solves the conventional problems such as long fabrication time of the probe structure, difficulty in finely controlling the structure of the probe structure, complexity of the whole process, mechanical instability of the products, and difficulty in uniformly assembling a plurality of the probe structures. Additionally, the probe structure of the present invention solves several problems caused in an actual testing step of the semiconductor devices, for instance, long testing time of the semiconductor device, difficulty in providing the sufficient contact force between the probe structure and the semiconductor device, and having to specially design the test pads of the semiconductor device.
    Type: Application
    Filed: April 18, 2002
    Publication date: October 24, 2002
    Applicant: IC MEMS, INC.
    Inventors: Dong-il Cho, Sangjun Park