Patents Assigned to ICDAT LTD.
  • Patent number: 11618683
    Abstract: A method for synthesizing a diamond by chemical vapor deposition, the method may include heating at least one internal space of at least one hot filament unit; wherein the at least one hot filament unit is positioned in a vacuum chamber; wherein a volume of each internal space out of the at least one internal space is smaller than one half of a volume of the vacuum chamber; feeding at least one gas to the at least one internal space; wherein the at least one gas comprises at least a carbon carrier gas; breaking the at least one gas by the at least one hot filament unit, to provide at least one radical; and depositing the at least one radical on an area of a substrate to provide the diamond.
    Type: Grant
    Filed: January 8, 2019
    Date of Patent: April 4, 2023
    Assignee: ICDAT LTD.
    Inventors: Dimitry Boguslavsky, Adam Hoffman
  • Publication number: 20210087065
    Abstract: A method for synthesizing a diamond by chemical vapor deposition, the method may include heating at least one internal space of at least one hot filament unit; wherein the at least one hot filament unit is positioned in a vacuum chamber; wherein a volume of each internal space out of the at least one internal space is smaller than one half of a volume of the vacuum chamber; feeding at least one gas to the at least one internal space; wherein the at least one gas comprises at least a carbon carrier gas; breaking the at least one gas by the at least one hot filament unit, to provide at least one radical; and depositing the at least one radical on an area of a substrate to provide the diamond.
    Type: Application
    Filed: January 8, 2019
    Publication date: March 25, 2021
    Applicant: ICDAT LTD.
    Inventors: Dimitry Boguslavsky, Adam Hoffman
  • Patent number: 10777429
    Abstract: There may be provided a method for generating a structure, the method may include receiving multiple donor structures that comprise multiple mesas; placing the multiple donor structures on a substrate that lacks a semiconductor layer that covers the entire substrate; and performing a manufacturing process that comprises coupling the multiple mesas to the substrate.
    Type: Grant
    Filed: October 17, 2018
    Date of Patent: September 15, 2020
    Assignee: ICDAT LTD.
    Inventors: Joseph Kaplun, Adam Hoffman