Patents Assigned to Iceotope Limited
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Patent number: 10306804Abstract: A sealable module, cooled electronic system and method are described relating to cooling a heat generating electronic device. The sealable module is adapted to be filled with a first cooling liquid and a heat transfer device having a conduction surface defines a channel for receiving a second cooling liquid. In one embodiment, at least a portion of the conduction surface or housing is shaped in conformity with the shape of the electronic component. Control of the second cooling liquid is also described. Transferring heat between the second cooling liquid and a third cooling liquid features in embodiments. A method of filling a container with a cooling liquid is further detailed.Type: GrantFiled: June 10, 2016Date of Patent: May 28, 2019Assignee: Iceotope LimitedInventors: Daniel Chester, Peter Hopton, Jason Bent, Keith Deakin
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Patent number: 9516791Abstract: A sealable module, cooled electronic system and method are described relating to cooling a heat generating electronic device. The sealable module is adapted to be filled with a first cooling liquid and a heat transfer device having a conduction surface defines a channel for receiving a second cooling liquid. In one embodiment, at least a portion of the conduction surface or housing is shaped in conformity with the shape of the electronic component. Control of the second cooling liquid is also described. Transferring heat between the second cooling liquid and a third cooling liquid features in embodiments. A method of filling a container with a cooling liquid is further detailed.Type: GrantFiled: January 22, 2013Date of Patent: December 6, 2016Assignee: ICEOTOPE LIMITEDInventors: Daniel Chester, Peter Hopton, Jason Bent, Keith Deakin
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Patent number: 9392727Abstract: A sealable module, cooled electronic system and method are described relating to cooling a heat generating electronic device. The sealable module is adapted to be filled with a first cooling liquid and a heat transfer device having a conduction surface defines a channel for receiving a second cooling liquid. In one embodiment, at least a portion of the conduction surface or housing is shaped in conformity with the shape of the electronic component. Control of the second cooling liquid is also described. Transferring heat between the second cooling liquid and a third cooling liquid features in embodiments. A method of filling a container with a cooling liquid is further detailed.Type: GrantFiled: March 1, 2013Date of Patent: July 12, 2016Assignee: ICEOTOPE LIMITEDInventors: Daniel Chester, Peter Hopton, Jason Bent, Keith Deakin
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Publication number: 20130208421Abstract: A sealable module, cooled electronic system and method are described relating to cooling a heat generating electronic device. The sealable module is adapted to be filled with a first cooling liquid and a heat transfer device having a conduction surface defines a channel for receiving a second cooling liquid. In one embodiment, at least a portion of the conduction surface or housing is shaped in conformity with the shape of the electronic component. Control of the second cooling liquid is also described. Transferring heat between the second cooling liquid and a third cooling liquid features in embodiments. A method of filling a container with a cooling liquid is further detailed.Type: ApplicationFiled: March 1, 2013Publication date: August 15, 2013Applicant: ICEOTOPE LIMITEDInventors: Daniel CHESTER, Peter HOPTON, Jason BENT, Keith DEAKIN
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Patent number: 8369090Abstract: A sealable module, cooled electronic system and method are described relating to cooling a heat generating electronic device. The sealable module is adapted to be filled with a first cooling liquid and a heat transfer device having a conduction surface defines a channel for receiving a second cooling liquid. In one embodiment, at least a portion of the conduction surface or housing is shaped in conformity with the shape of the electronic component. Control of the second cooling liquid is also described. Transferring heat between the second cooling liquid and a third cooling liquid features in embodiments. A method of filling a container with a cooling liquid is further detailed.Type: GrantFiled: May 11, 2010Date of Patent: February 5, 2013Assignee: Iceotope LimitedInventors: Daniel Chester, Peter Hopton, Jason Bent, Keith Deakin
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Publication number: 20100290190Abstract: A sealable module, cooled electronic system and method are described relating to cooling a heat generating electronic device. The sealable module is adapted to be filled with a first cooling liquid and a heat transfer device having a conduction surface defines a channel for receiving a second cooling liquid. In one embodiment, at least a portion of the conduction surface or housing is shaped in conformity with the shape of the electronic component. Control of the second cooling liquid is also described. Transferring heat between the second cooling liquid and a third cooling liquid features in embodiments. A method of filling a container with a cooling liquid is further detailed.Type: ApplicationFiled: May 11, 2010Publication date: November 18, 2010Applicant: ICEOTOPE LIMITEDInventors: Daniel Chester, Peter Hopton, Jason Bent, Keith Deakin
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Patent number: 7609518Abstract: A tank and a lid are configured to mate to provide a substantially airtight container for containing a processing board for a computer and a liquid. A cooling system is configured to cool the interior of the container, and a serial data connection is provided between the processing board and the exterior of the container.Type: GrantFiled: November 16, 2006Date of Patent: October 27, 2009Assignee: Iceotope LimitedInventors: Peter John Hopton, Simon Kevin Bown