Abstract: Provided is a light-emitting diode (LED) lighting apparatus including: a printed circuit board (PCB) having a planar structure; a LED chip mounted on a surface of the PCB; a support coupled to another surface of the PCB; and a heat sink that is coupled to the support and dissipates heat generated in the LED chip, wherein the support comprises a discontinuous through hole extending through two surfaces of the support, and the heat sink is coupled to the support when a portion of the heat sink inserted from a surface of the support into the through hole contacts the PCB.

Abstract: Provided is a light emitting diode (LED) lighting apparatus. The LED lighting apparatus includes a printed circuit board (PCB) having a plate-shaped structure with an opened center portion; an LED chip mounted on a surface of the PCB; a ventilation unit including an end portion having an opening, other end portion coupled to the opened center portion of the PCB, and an air flowing passage connecting the opening and the opened center region of the PCB to each other; a heat sink coupled to the other surface of the PCB so as to cool down heat generated from the LED chip; a cover member including an air flowing hole corresponding to a location of the opening and covering partially the PCB, the LED chip, the ventilation unit, and the heat sink; and a base including a ventilation hole that is capable of connecting to the air flowing path and coupled to the cover ember so as to cover remaining parts of the PCB, the LED chip, the ventilation unit, and the heat sink.

Abstract: A heat-dissipating device for an electronic apparatus can include: a thermal base coupled to a first electronic component in such a manner that enables heat-transfer therebetween so that heat generated by the first electronic component mounted on a substrate is absorbed thereby; and a vibrating capillary-shaped heat-pipe loop comprising a first heat-absorption portion coupled with the thermal base in such a manner that enables heat-transfer therebetween and a heat-dissipating portion configured to dissipate heat absorbed by the first heat-absorption portion, the heat-pipe loop having working fluid injected thereinto. The heat-pipe loop can be radially disposed with a central area thereof hollowed out, and an assembly area of a coupling member can be exposed in the central area so that the coupling member for coupling the thermal base to the substrate is coupled through the central area.

Abstract: Disclosed is a light-emitting diode (LED) lighting apparatus. The LED lighting apparatus comprises: a light source module comprising an LED light source; a thermal base coupled to the light source module so as to receive heat generated by the light source module; and a heat-dissipating member comprising a ventilation unit coupled to an edge region of the thermal base so as to discharge heat transmitted from the thermal base and open a central area of the thermal base so as to facilitate air ventilation to the outside. The LED lighting apparatus can increase heat-dissipating efficiency by maximizing ventilation efficiency and enabling air around the heat-dissipating member to flow smoothly without stagnating.

Abstract: There is disclosed a manufacturing method of a heat pipe type heat-dissipating device. The method includes the steps of: winding a pipe on a loop forming mold in a spiral shape to form a pipe loop; and pressing at least a section of an outer circumference of the pipe loop so that the pipe loop is plastically deformed in a shape corresponding to the shape of the loop forming mold.