Abstract: Disclosed is a high-dielectric adhesive film, particularly a high-dielectric adhesive film including a substrate layer, a ceramic-mixed layer formed on one surface of the substrate layer and an adhesive layer formed on the surface of the substrate layer on which the ceramic-mixed layer is formed. The high-dielectric adhesive film thus configured is improved in permittivity due to the use of a ceramic component, thus preventing the malfunction of electronic devices, increasing the stability and performance thereof, and exhibiting heat dissipation effects.

Abstract: Disclosed is a low-resistance conductive tape enhancing and maintaining RF performance and having an excellent effect of preventing galvanic corrosion and oxidation. More particularly, the low-resistance conductive tape includes a conductive fiber layer including conductive fibers, a conductive adhesive layer formed on an upper side and a lower side of the conductive fiber layer, and a metal layer which is formed on one side of the conductive fiber layer having the conductive adhesive layer formed thereon and which includes copper plated with nickel. In the low-resistance conductive tape, since the metal layer including copper plated with nickel is formed, an excellent effect of preventing galvanic corrosion and an excellent moisture-blocking effect are exhibited, and an acrylic adhesive containing no acid component is used, thus securing an excellent effect of preventing oxidation.

Abstract: Disclosed is a low-resistance conductive tape enhancing and maintaining RF performance and having an excellent effect of preventing galvanic corrosion and oxidation. More particularly, the low-resistance conductive tape includes a conductive fiber layer including conductive fibers, a conductive adhesive layer formed on an upper side and a lower side of the conductive fiber layer, and a metal layer which is formed on one side of the conductive fiber layer having the conductive adhesive layer formed thereon and which includes copper plated with nickel. In the low-resistance conductive tape, since the metal layer including copper plated with nickel is formed, an excellent effect of preventing galvanic corrosion and an excellent moisture-blocking effect are exhibited, and an acrylic adhesive containing no acid component is used, thus securing an excellent effect of preventing oxidation.

Abstract: A gasket is formed by applying an adhesive on four sides of an elastic body of a closed cell polyurethane material, wrapping a copper film around the elastic body other than a bottom bonding surface, forming a coating layer by depositing or plating nickel on a surface exposing the copper film, and forming a resin coating layer on the nickel coating layer A conductive adhesive is applied on the bottom surface.