Abstract: A carrier module of a tire pressure monitoring device includes a plastic carrier and a metallic tube. The plastic carrier has a trough and a tube extended from a bottom portion of the trough. The trough has an airflow channel penetratingly formed on the bottom portion thereof, and the trough is in air communication with the tube by the airflow channel The metallic tube is seamlessly formed on an inner surface of the tube of the plastic carrier. The metallic tube has an inner screw thread formed on an inner surface thereof for detachably screwing to a nozzle of a tire. Thus, by seamlessly forming the metallic tube on the inner surface of the tube of the plastic carrier, the tire pressure monitoring device of the instant disclosure has a better airproof effect and a longer service life.

Abstract: A flexible circuit board includes a substrate and a circuit unit formed on the substrate. The substrate has two carrying segments and a connecting segment, and the two carrying segments are connected by the connecting segment. The circuit unit has a plurality of conductive lines and at least one connecting line, and each conductive line and the connecting line are separated from each other. The conductive lines are respectively formed on the two carrying segments, and the connecting line is formed on the connecting segment and the two carrying segments. Two opposite ends of each carrying segment are configured to connect with each other to form a tubular structure, and two opposite ends of the connecting line are configured to connect to two adjacent conductive lines respectively formed on the two tubular structures, thereby the circuit unit is formed as a coil.

Abstract: A method of manufacturing a printed circuit board precursor includes the steps of providing a substrate. Then the surface of the substrate is catalyzed to form a catalytic layer by a catalyst. Subsequently, a conductive layer is formed and attached to the surface of the catalytic layer. Finally, a metal layer is electroplated on the conductive layer. A printed circuit board precursor includes a substrate having a surface. Specifically, the surface is catalytically treated to form a catalytic layer. The precursor also includes a conductive layer which is attached to and covers the catalytic layer and a metal layer which is disposed on the conductive layer.

Abstract: A flexible circuit board comprises a substrate which has a polyimide layer recessed to define at least a compartment. The compartment includes an inner wall surface having a side wall and a bottom wall. The compartment is for containing a multilayer unit, wherein the multilayer unit includes an adhesion enhancing layer formed on the wall of the compartment, a first electrically conducting layer disposed on the adhesion enhancing layer, and a second electrically conducting layer formed on the first electrically conducting layer. The adhesion enhancing layer is palladium. The first electrically conducting layer is nickel. The substrate is composed of polyimide (PI).

Abstract: A thin key structure includes a circuit module, a frame having has a retaining portion, an elastic member disposed on the circuit module and arranged in the frame, and a pressable module having a positioning sheet and a key. The positioning sheet has an assembling portion installed on the frame, a connecting portion, and an extending portion connecting there-between. The key has a key body fixed on the connecting portion and a stopping portion extended from the key body. The key body has a concaving portion aligning the extending portion. The stopping portion is movably arranged in the retaining portion. When non-center portion of the key body is pressed, part of the stopping portion, away from the pressed portion of the key body, abuts against the corresponding retaining portion for being a fulcrum, such that the pressed portion of the key body rotates to press the elastic member.

Abstract: A thin push button structure includes a main board, a circuit board, an elastic element, a supporting plate, a key top and a frame. The circuit board is disposed on the main board and formed with a plurality of cavities. The supporting plate includes a seat, an extending portion and a contacting portion. The seat is formed with a window at the central region and connected to the contacting portion by the extending portion. The elastic element is disposed on the circuit board. The key top includes a main body and a plurality of posts that extend therefrom. The frame includes a through opening and a plurality of alignment grooves at the periphery of the opening. The frame sleeves the key top, and the posts are received by the alignment grooves. The key top caps the contacting portion and is movable within the alignment grooves and the cavities.

Abstract: A thin key structure includes a supporting module, a circuit module disposed on the supporting module, a frame and a metal dome disposed on the circuit module, a pressable module, and a guiding portion. The supporting module has a supporting plate and a protrusion disposed on the supporting plate. The supporting plate has a plane defined therein, the plane defines a perpendicular central axis, and the protrusion is arranged on the central axis. The circuit module has a protruding segment formed by the protrusion. The metal dome is arranged in the frame, and has a contact portion arranged on the central axis. The guiding portion arranged on the central axis and is disposed between the contact portion and the pressable module. The metal dome is pressed by the guiding portion to move the contact portion along the central axis and selectively abuts the circuit module.

Abstract: A thin push button structure includes a main board, a circuit board, an elastic element, a supporting plate, a key top and a frame. The circuit board is disposed on the main board and formed with a plurality of cavities. The supporting plate includes a seat, an extending portion and a contacting portion. The seat is formed with a window at the central region and connected to the contacting portion by the extending portion. The elastic element is disposed on the circuit board. The key top includes a main body and a plurality of posts that extend therefrom. The frame includes a through opening and a plurality of alignment grooves at the periphery of the opening. The frame sleeves the key top, and the posts are received by the alignment grooves. The key top caps the contacting portion and is movable within the alignment grooves and the cavities.

Abstract: A method of manufacturing a printed circuit board precursor includes the steps of providing a substrate. Then the surface of the substrate is catalyzed to form a catalytic layer by a catalyst. Subsequently, a conductive layer is formed and attached to the surface of the catalytic layer. Finally, a metal layer is electroplated on the conductive layer. A printed circuit board precursor includes a substrate having a surface. Specifically, the surface is catalytically treated to form a catalytic layer. The precursor also includes a conductive layer which is attached to and covers the catalytic layer and a metal layer which is disposed on the conductive layer.

Abstract: A thin key structure includes a circuit module, a frame having has a retaining portion, an elastic member disposed on the circuit module and arranged in the frame, and a pressable module having a positioning sheet and a key. The positioning sheet has an assembling portion installed on the frame, a connecting portion, and an extending portion connecting there-between. The key has a key body fixed on the connecting portion and a stopping portion extended from the key body. The key body has a concaving portion aligning the extending portion. The stopping portion is movably arranged in the retaining portion. When non-center portion of the key body is pressed, part of the stopping portion, away from the pressed portion of the key body, abuts against the corresponding retaining potion for being a fulcrum, such that the pressed portion of the key body rotates to press the elastic member.

Abstract: The invention relates to a test strip. The test strip comprises an insulating sheet; a metallic circuit layer disposed on the insulating sheet, the metallic circuit layer including at least an electrode section; a sensing reagent layer provided on the electrode section; an intermediate layer disposed to cover the insulating sheet and the metallic circuit layer, the intermediate layer having an opening to expose the sensing reagent layer and the electrode section; and a cover disposed to cover the intermediate layer and the insulating sheet, and expose part of the metallic circuit layer, the cover having two holes corresponding to the opening. The test strip is provided in a combination of printing manner and chemical plating such as metallic ion replacement or electroless plating to form the metallic circuit layer readily so as to enhance the stability of resistance and the test accuracy.

Abstract: The invention provides a method of fabricating test strips for measuring biological blood. The method comprises steps: preparing an insulating membrane material; printing a metallic circuit layer on the insulating membrane material by a metallic ionic ink; performing a surface treatment for the metallic circuit layer expose metallic ions of the metallic ionic ink; chemical plating for the exposed metallic ions of the metallic circuit layer to form an electrode section on the metallic circuit layer; providing a sensing reagent on the electrode section to form a sensing reagent layer; sequentially adhering an intermediate layer and a cover to the insulating membrane material to cover the metallic circuit layer and expose part of the metallic circuit layer; and cutting the insulating membrane material to form a plurality of insulating sheets. The test strip is provided to enhance the stability of resistance and the test accuracy.

Abstract: The present invention provides a multi-layer flexible circuit board, comprising at least an electric circuit disposed on a vertical interval layer, wherein at least two sides of the electric circuit are covered by neighboring interval layer and another vertical interval composed layer of electric insulating material. The disclosure provides a non-pressing way to stack the multi-layer flexible circuit board, preventing fault crevice derived from a prior-known pressing way.

Abstract: A thin key structure includes a supporting module, a circuit module disposed on the supporting module, a frame and a metal dome disposed on the circuit module, a pressable module, and a guiding portion. The supporting module has a supporting plate and a protrusion disposed on the supporting plate. The supporting plate has a plane defined therein, the plane defines a perpendicular central axis, and the protrusion is arranged on the central axis. The circuit module has a protruding segment formed by the protrusion. The metal dome is arranged in the frame, and has a contact portion arranged on the central axis. The guiding portion arranged on the central axis and is disposed between the contact portion and the pressable module. The metal dome is pressed by the guiding portion to move the contact portion along the central axis and selectively abuts the circuit module.

Abstract: A flexible circuit board comprises a substrate which has a polyimide layer recessed to define at least a compartment. The compartment includes an inner wall surface having a side wall and a bottom wall. The compartment is for containing a multilayer unit, wherein the multilayer unit includes an adhesion enhancing layer formed on the wall of the compartment, a first electrically conducting layer disposed on the adhesion enhancing layer, and a second electrically conducting layer formed on the first electrically conducting layer. The adhesion enhancing layer is palladium. The first electrically conducting layer is nickel. The substrate is composed of polyimide (PI).

Abstract: The present invention provides a flexible circuit board, comprising at least a multilayer unit disposed on a substrate, wherein the multilayer unit includes: an adhesion enhancing layer formed within the surface of the substrate, a first electrical conducting unit disposed on the adhesion enhancing layer, and a second electrical conducting layer formed on the first electrical conducting layer, wherein the adhesion enhancing layer is Palladium, the first electrical conducting layer is Nickel, and the substrate is composed of polyimide(PI).

Abstract: The invention provides a test strip for measuring biological fluid. The test strip comprises an insulating sheet, a circuit layer, a sensing reagent layer, an intermediate layer and a cover. The circuit layer is disposed on the insulating sheet, the circuit layer connecting to an electrode section. The sensing reagent layer is disposed on the electrode section. The intermediate layer is provided to cover the insulating sheet and the circuit layer, the intermediate layer having an opening to expose the sensing reagent layer and the electrode section. The cover is provided to cover the intermediate layer and the insulating sheet and expose part of the circuit layer, the cover having two holes corresponding to the opening. The circuit layer is provided in an adhering manner to enhance the stability of resistance and the test accuracy.

Abstract: The invention provides a method of fabricating test strip for measuring biological fluid. The method comprises steps of: preparing a metallic membrane and an insulating material; adhering the metallic membrane on the insulating material; photolithographing for the metallic membrane; etching the metallic membrane to form a circuit layer; providing a sensing reagent on the circuit layer to form a sensing reagent layer; and adhering an intermediate layer and a cover to the insulating material to cover the circuit layer and expose part of the circuit layer. The circuit layer is provided in an adhering manner to enhance the stability of resistance and the test accuracy.

Abstract: An electrophoretic display keypad structure utilizes a whole piece of electrophoretic display film to show a plurality of figures for keys. The electrophoretic display film is disposed on a printed circuit board having a patterned electrode and sealed by a sealant or a sealing material applied to entire periphery of the electrophoretic display film for preventing humidity or pollution, thereby to display excellent figures and be made relatively easily. The figures displayed may be changed by selecting a desired mode, and users may accordingly easily choose desired figures for pressing the keys.

Abstract: A control method of a control panel is disclosed. First, a first display plate having at least one first pattern is provided, and the first display plate is in an on-state, so that the first pattern is shown. Then, a touch region of a touch panel disposed on the first display plate is touched, and a second display plate having at least one second pattern and disposed under the first display plate is turned on, so that the second pattern is displayed. Accordingly, changes of different patterns respectively in different layers can be displayed.