Abstract: Apparatuses for controlling fluid flow are important components for delivering process fluids for semiconductor fabrication. These apparatuses for controlling fluid flow frequently rely on large numbers of fitting assemblies. Fitting assemblies often require tight tolerances, requiring expensive manufacturing processes. Fitting assemblies formed as multiple components can reduce manufacturing costs. Fitting assemblies may be formed of a housing having an insert receiving cavity and an insert having a port, a seal cavity, and a tube stub. A flow path extends from the port to the tube stub to enable flow of fluid therebetween.

Abstract: A gas flow control system for delivering a plurality of gas flows. The gas flow control system has a gas flow path extending from a gas inlet to first and second gas outlets. First and second flow restrictors are operably coupled to the gas flow path. First and second valves are operably coupled to the gas flow path such that when both first and second valves are in a fully open state, flows of gas from the first and second gas outlets are split according to the impedances of the first and second flow restrictors.

Abstract: Apparatuses for controlling fluid flow are important components for delivering process fluids for semiconductor fabrication. These apparatuses for controlling fluid flow are formed with a variety of fluid flow components, including fluid flow components for mixing fluid flows. Fluid flow components for mixing flows utilize mixing elements configured to receive flows of two or more process fluid flows via fluid inlets, mix the fluid flow within the mixing element, and deliver mixed fluid to a down-stream fluid flow component or an outlet of an apparatus for controlling fluid flow.

Abstract: Apparatuses for controlling fluid flow are important components for delivering process fluids for semiconductor fabrication. These apparatuses for controlling fluid flow require a variety of fluid flow components which are tightly packaged within the apparatuses for controlling flow. Servicing the apparatuses requires specialized equipment and methods which enable installation of seals in close quarters in apparatuses which are installed in the field. Seal retainers may be used to retain the seals during assembly of fluid flow components into apparatus for controlling flow.

Abstract: A gas flow control system for delivering a plurality of gas flows. The gas flow control system has a gas flow path extending from a gas inlet to first and second gas outlets. First and second flow restrictors are operably coupled to the gas flow path. First and second valves are operably coupled to the gas flow path such that when both first and second valves are in a fully open state, flows of gas from the first and second gas outlets are split according to the impedances of the first and second flow restrictors.

Abstract: In one embodiment, a flow control system for delivering a fluid at a predetermined rate includes a base having a flow path extending from an inlet to an outlet, a proportional valve operably coupled to the base to control fluid flow through the flow path, a flow restrictor located between the proportional valve and the outlet, and a pressure transducer fluidly coupled to a volume of the flow path. The volume is defined between the proportional valve and the flow restrictor.

Abstract: Apparatuses for controlling fluid flow are important components for delivering process fluids for semiconductor fabrication. These apparatuses for controlling fluid flow frequently rely on valves which can provide flows at different rates and in a minimally turbulent manner. In one embodiment, a valve assembly is disclosed, the valve assembly having a valve body, a closure member, a seat, and a radial flow guide. The radial flow guide has a plurality of flow passages. The closure member has a needle, the needle having a plurality of grooves therein. The resulting valve assembly enables improved control of fluid and reduces turbulence in the resultant flow.

Abstract: Systems for processing articles are essential for semiconductor fabrication. These systems employ a variety of apparatuses for controlling flow. In one implementation, an apparatus for controlling flow may utilize a body having a flow path extending from an inlet to an outlet. A valve, a flow restrictor, and a pressure sensor are operably coupled to the flow path. The valve incorporates first and second actuators which enable control of mass flow rates of fluid flowing through the flow path.

Abstract: Fluid delivery systems are important component assemblies used for semiconductor fabrication. These fluid delivery systems rely on assemblies of components, requiring seals which must be installed and replaced during assembly and maintenance of the fluid delivery systems. Seals may be arranged as seal rings which engage substrate blocks or active components, the seal rings having seal retention features which aid in assembly. These seal retention features may increase the retention force of the seal in a seal cavity or may reduce the force required to retain the seal. In other arrangements, the seal cavities of the substrate blocks or active components may incorporate seal retention features.

Abstract: Apparatuses for controlling gas flow are important components for delivering process gases for semiconductor fabrication. In one embodiment, an apparatus for controlling gas flow is disclosed, the apparatus delivering two gas flows at a known ratio. Specifically, the apparatus has first and second on/off valves and first and second flow restrictors. The first and second on/off valves may be altered between an open state and a closed state. When both the first and second on/off valves are in an open state, first and second gas flows are delivered to first and second outlets. The first and second gas flows are provided at a known ratio to one another, this ratio determined by the ratio of the resistance to flow of the first and second flow restrictors.

Abstract: Apparatuses for controlling gas flow are important components for delivering process gases for semiconductor fabrication. In one embodiment, a gas flow control system for achieving improved transient response in apparatuses for controlling gas flow is disclosed. Specifically, by providing a command to an apparatus to deliver a predetermined mass flow rate at a future turn on time, the apparatus is able to pre-pressurize a P1 volume so that the response time of the apparatus is no longer dependent on the speed of the apparatus's control valves and the limitations of the control loop.

Abstract: Apparatuses for controlling gas flow are important components for delivering process gases for semiconductor fabrication. In one embodiment, a method of achieving improved transient response in apparatuses for controlling gas flow is disclosed. Specifically, by providing a command to the apparatus to deliver a predetermined mass flow rate at a future turn on time, the apparatus is able to pre-pressurize a P1 volume so that the response time of the apparatus is no longer dependent on the speed of the apparatus's control valves and the limitations of the control loop.

Abstract: Apparatuses for controlling gas flow are important components for delivering process gases for semiconductor fabrication. In one embodiment, a method of calibrating an apparatus for controlling gas flow is disclosed. Specifically, the apparatus may be calibrated on installation using a two-step process of measuring the volume of gas box downstream from the apparatus by flowing nitrogen gas into the gas box and measuring the resulting temperature and rate of pressure rise. Using the computed volume of the gas box, a sweep of several mass flow rates may be performed using the process gas and the gas map for the process gas. The apparatus is calibrated based on the measured temperature and pressure values, which allow calculation of the actual mass flow rate for the process gas as compared with the commanded mass flow rates.