Patents Assigned to ICI Array Technology, Inc.
  • Pin grid array assembly
    Patent number: 4882657
    Abstract: An electronic assembly includes a body having semiconductor devices positioned on one or more surfaces thereof, and a plurality of vias therethrough operatively connected with the semiconductor devices, the vias being positionable into contact with elastomer conductors which in turn are in contact with the recessed heads of pins of a pin grid array. The body and pin grid array are brought together to form such assembly, being held together but resiliently urged apart by the elastometer conductors in contact with the pins and the vias.
    Type: Grant
    Filed: April 6, 1988
    Date of Patent: November 21, 1989
    Assignee: ICI Array Technology, Inc.
    Inventor: Randall E. Braun