Patents Assigned to ICI Japan Limited
  • Bonded magnet moulding compositions
    Patent number: 5409624
    Abstract: Compositions for making a bonded magnet product by conventional moulding techniques comprising high amounts of magnetic particles together with a polyamide resin and from about 0.2 to 3% by weight of a hindered phenol hydrazine compound are described.
    Type: Grant
    Filed: November 12, 1993
    Date of Patent: April 25, 1995
    Assignee: ICI Japan Limited
    Inventor: Ryoji Watanabe
  • Bonded magnet molding composition and bonded magnet
    Patent number: 5376291
    Abstract: Compositions for making a bonded magnet product by conventional moulding techniques comprise high amounts of magnetic particles together with a polyamide resin and from about 0.2 to 3% by weight of a hindered phenol compound.
    Type: Grant
    Filed: January 29, 1993
    Date of Patent: December 27, 1994
    Assignee: ICI Japan Limited
    Inventor: Ryoji Watanabe