Patents Assigned to iGEN Technologies Inc.
  • Publication number: 20180347867
    Abstract: An apparatus includes an evaporator-expansion module configured to (A) provide electric energy to a building structure, and (B) cooperate with an air-handler module configured to provide thermal energy to a building structure. The evaporator-expansion module includes an evaporator assembly including a heated fluid conduit, a refrigerant conduit, and a thermal buffer. The heated fluid conduit is configured to convey a heated fluid. The refrigerant conduit is configured to convey an evaporator refrigerant. The thermal buffer is configured to be positioned relative to the heated fluid conduit and the refrigerant conduit. This is done in such a way that the thermal buffer transfers thermal energy from the heated fluid that is positioned in the heated fluid conduit to the evaporator refrigerant that is positioned in the refrigerant conduit.
    Type: Application
    Filed: June 5, 2017
    Publication date: December 6, 2018
    Applicant: iGEN Technologies Inc.
    Inventor: Patrick LAI