Abstract: A printed circuit board includes a substrate having an opening portion, a chip capacitor device accommodated in the opening portion of the substrate, and a buildup structure formed on the substrate such that the buildup structure covers the chip capacitor device in the opening portion of the substrate. The chip capacitor has a dielectric body having a surface facing the buildup structure, first electrodes formed on the surface of the dielectric body and second electrodes formed on the surface of the dielectric body, and the buildup structure has first via structures and second via structures such that the first via structures are connected to the first electrodes, respectively, and the second via structures are connected to the second electrodes, respectively.