Abstract: Provided is an ultra-thin copper foil to which a carrier foil is attached, including: a carrier foil, a peeling layer, and an ultra-thin copper foil, wherein the peeling layer includes a first metal A having peelability, a second metal B and a third metal C facilitating coating of the first metal, wherein the amount (a) of the first metal A is in a range of about 30 to about 89% by total weight of the peeling layer, the amount (b) of the second metal B is in a range of about 10 to about 60% by total weight of the peeling layer, and the amount (c) of the third metal C is in a range of about 1 to about 20% by total weight of the peeling layer.

Abstract: The present invention provides a nitrogen-oxide gas sensor that is able to measure nitric oxide and nitrogen dioxide at the same time and ensure measurement accuracy and long stability. For these purposes, the nitrogen-oxide gas sensor includes: an oxide ion conductive solid electrolyte; a primary film that contacts the solid electrolyte and is made of a p-type semi-conductor metal oxide; a secondary film that contacts the solid electrolyte and is made of a p-type semiconductor metal oxide; an n-type semiconductor metal oxide that is included in at least one of the primary and secondary films; a power source that applies electric power to the primary and secondary films by electrically connecting a primary node to the primary film and a secondary node to the secondary film; and a measurement unit that measures the electric potential difference between the primary and secondary nodes.

Abstract: A nitrogen-oxide gas sensor that is able to measure a nitric oxide and a nitrogen dioxide at the same time, and ensure sensing accuracy and stability over a long period of time. The nitrogen-oxide gas sensor includes: a first oxygen ion conductive solid electrolyte; a first film contacting the first oxygen ion conductive solid electrolyte and formed of a metal oxide; a second film contacting the first oxygen ion conductive solid electrolyte and formed of a metal oxide; a power supply source for applying a current to the first and second films by electrically connecting a first node to the first film and a second node to the second film; a measurement unit for measuring an electric potential difference between the first and second nodes; and a temperature adjustment unit for uniformly maintaining a temperature of at least one of the first and second films.

Abstract: The present invention provides a nitrogen-oxide gas sensor that is able to measure nitric oxide and nitrogen dioxide at the same time and ensure measurement accuracy and long stability. The present invention relates to the nitrogen-oxide gas sensor that includes: an oxide ion conductive solid electrolyte; a primary film made of a metal oxide which contacts the solid electrolyte; a secondary film made of a metal oxide that contacts with the solid electrolyte and is separated from the first film; a power source that applies electric power to the primary and secondary films by electrically connecting a primary node to the primary film and a secondary node to the secondary film; a tertiary film made of a metal oxide that contacts the solid electrolyte, wherein the tertiary film and the primary film are connected to the power source in parallel; and a measurement unit that measures the electric potential difference between the primary and secondary nodes.

Abstract: The present invention provides a nitrogen-oxide gas sensor that is able to measure nitric oxide and nitrogen dioxide at the same time and ensure measurement accuracy and long stability. For these purposes, the nitrogen-oxide gas sensor includes: an oxide ion conductive solid electrolyte; a primary film that contacts the solid electrolyte and is made of a p-type semi-conductor metal oxide; a secondary film that contacts the solid electrolyte and is made of a p-type semiconductor metal oxide; an n-type semiconductor metal oxide that is included in at least one of the primary and secondary films; a power source that applies electric power to the primary and secondary films by electrically connecting a primary node to the primary film and a secondary node to the secondary film; and a measurement unit that measures the electric potential difference between the primary and secondary nodes.

Abstract: Provided is a metal frame for an electronic part and capable of minimizing defects such as an electric short circuit caused by whiskers. The metal frame may include a lead unit electrically connected to an electronic device, and the lead unit may include a first metal layer that contains copper (Cu) as a main component and further contains boron (B) or beryllium (Be).

Abstract: A stent includes a magnesium layer, a ceramic layer formed over the magnesium layer, and a magnesium compound layer interposed between the magnesium layer and the ceramic layer. The initial corrosion of the stent can be delayed, and the stent has excellent biocompatibility and thus can reduce side effects during cell proliferation and differentiation.

Abstract: Provided is an ultra-thin copper foil to which a carrier foil is attached, including: a carrier foil, a peeling layer, and an ultra-thin copper foil, wherein the peeling layer includes a first metal A having peelability, a second metal B and a third metal C facilitating coating of the first metal, wherein the amount (a) of the first metal A is in a range of about 30 to about 89% by total weight of the peeling layer, the amount (b) of the second metal B is in a range of about 10 to about 60% by total weight of the peeling layer, and the amount (c) of the third metal C is in a range of about 1 to about 20% by total weight of the peeling layer.

Abstract: The present invention is provided to prevent the generation of whiskers via a lead (Pb)-free solder alloy. To achieve this objective, the present invention provides a Pb-free solder alloy including tin (Sn) as a first element and either boron (B) or beryllium (Be) as a second element.

Abstract: The object of the present invention is to prevent generation of whisker in a Pb-free plating layer. Provided is a Pb-free Sn—B plating solution containing tin sulfate, which is a source of Sn ions, and dimethyl amine borane or trimethyl amine borane, which is a source of B ions.

Abstract: The present invention generally relates to an electrolyte solution used to manufacture an electrolytic copper foil for a secondary battery electrode collector and a printed circuit, and based on a 1-liter electrolyte solution, the present invention contains: 0.5 to 40 mg of at least one sulfur compound selected from a disulfur compound, dialkylamino- T-oxomethyl- thioalkan sulfonic acid, and thioalkan sulfonic acid salt; 1 to 1000 mg of at least more than one kind of an organic compound selected from a group consisting of a poly aklylene glycol-type surfactant and low molecular gelatin; and 0.1 to 80 mg of chlorine ion.