Patents Assigned to ILJIN Corporation, Inc.
  • Publication number: 20030153117
    Abstract: The present invention relates to an optical integrated circuit device, a fabrication method of the same and a module of an optical communication transmission and receiving apparatus using the same. The optical integrated circuit device comprises a semiconductor substrate, an active layer formed on an upper surface of the semiconductor substrate, a first current disconnection layer formed on an upper surface of the semiconductor substrate at both sides of the active later, a second current disconnection layer formed on an upper surface of the first current disconnection layer, and a convex portion formed on an upper portion of the active layer and an upper surface of the second current disconnection layer.
    Type: Application
    Filed: January 14, 2003
    Publication date: August 14, 2003
    Applicant: ILJIN Corporation, Inc.
    Inventor: Ki Chul Shin