Abstract: The present disclosure relates to an electrolytic copper foil for graphene and a method for producing the copper foil, in which, in the manufacture of the electrolytic copper foil for graphene, addition of nickel facilitates the synthesis of the graphene. The addition of nickel which serves as a seed in the synthesis of graphene on electrolytic copper foil reduces the electrical conductivity after graphene synthesis. As a result, graphene is uniformly formed on the surface of the copper foil. Further, the present disclosure may provide the electrolytic copper foil for graphene and the method for producing the copper foil in which an electrolytic copper foil having a resistance value of less than 300 ohm/square after the synthesis of the graphene on the electrolytic copper foil is produced, thereby, facilitate the formation of graphene on the electrolytic copper foil.

Abstract: The present invention is related to an anode for a secondary battery, a method of manufacturing the same, and a lithium secondary battery using the same, the anode including: an electrolytic copper foil current collector; an anode active material layer which is provided on a single surface or both surfaces of the electrolytic copper foil current collector and includes lithium powder; and a protective layer provided on the anode active material layer, in which a thickness of the electrolytic copper foil current collector is 2 ?m to 20 ?m, and a thickness of the anode active material layer and the protective layer provided on the electrolytic copper foil current collector is 100 ?m or less.

Abstract: The present disclosure provides an electrolytic copper foil composed of a single layer or a stack of two or more layers, wherein the electrolytic copper foil has Total Organic Carbon (TOC) content equal to or smaller than 4 ppm, and has chlorine (Cl) content equal to or smaller than 10 ppm, wherein the electrolytic copper foil has a thickness, a tensile strength, and an elongation satisfying a relationship 1 below: relationship 1: thickness (?m)/(tensile strength (kgf/mm2)*elongation (%))?0.1.

Abstract: The present invention relates to an electrolytic copper foil for a secondary battery, having excellent physical properties at a low temperature, and a method for producing the electrolytic copper foil. The electrolytic copper foil for a secondary battery shows little change in the physical properties, such as tensile strength and elongation, of a copper foil even at a low temperature and thereby exhibits excellent cycle properties at the low temperature. The electrolytic copper foil for a secondary battery is produced from a plating solution, containing total organic carbon (TOC), cobalt, iron and zinc, by using a drum and coated with a cathode active material, wherein the ratio between the TOC, cobalt, iron and zinc contained in the electrolytic copper foil follows the following formula 1: TOC/(cobalt+iron+zinc)=1.0-1.2.

Abstract: The present invention relates to an electrolytic copper foil for a secondary battery and a method of producing the same, and more particularly, to an electrolytic copper foil for a secondary battery, which has little change in a physical property of a copper foil before and after vacuum drying in a process of producing an electrolytic copper foil, thereby exhibiting excellent cycle life in a battery test at a high-density negative electrode, and preventing cracking. The electrolytic copper foil for a secondary battery is produced from a plating solution containing Total Organic Carbon (TOC), zinc, and iron by using a drum, in which a ratio of the TOC to the zinc and the iron contained in the electrolytic copper foil follows Formula 1 below: TOC/(zinc+iron)=1.3 to 1.

Abstract: The present invention relates to an electrolytic copper foil for a secondary battery, having excellent flexural resistance, and a method for producing the electrolytic copper foil. The electrolytic copper foil for a secondary battery has excellent flexural resistance even without the use of many additives in a copper electrolyte when producing a copper foil. The electrolytic copper foil for a secondary battery according to the present invention is an electrolytic copper foil for a secondary battery, which is produced from a plating solution, containing total organic carbon (TOC), cobalt and arsenic, by using a drum and is coated with a cathode active material, wherein the ratio between the TOC, cobalt and arsenic contained in the electrolytic copper foil follows the following formula 1: [Formula 1] TOC/(cobalt+arsenic)=1.30-1.55.

Abstract: The present invention relates to an electrolytic copper foil for a secondary battery and a method of producing the same. The electrolytic copper foil for a secondary battery, in which a burr and curl of a negative electrode plate are inhibited from being formed after an electrolytic copper foil is coated with a negative electrode active material, thereby increasing the loading volume of a negative electrode and increasing a capacity. The electrolytic copper foil for a secondary battery is produced from a plating solution containing Total Organic Carbon (TOC) by using a drum, in which the electrolytic copper foil is formed of one surface that is in direct contact with the drum and the other surface that is an opposite surface of the one surface, and an average cross-sectional grain size of the one surface is 80% or less of an average cross-sectional grain size of the other surface.

Abstract: The present invention relates to an electrolytic copper foil for a secondary battery, and a method of producing the same. The electrolytic copper foil for a secondary battery exhibits a little change in a physical property caused by a difference in a crosshead speed when tensile strength and an elongation percentage of the electrolytic copper foil are measured, thereby achieving excellent charging and discharging characteristics of a battery and preventing exfoliation of an active material. The electrolytic copper foil for a secondary battery is produced from a plating solution containing Total Organic Carbon (TOC), cobalt, and iron by using a drum, in which a ratio of the TOC to the cobalt and the iron contained in the electrolytic copper foil follows Formula 1 below. TOC/(cobalt+iron)=1.3 to 1.

Abstract: The present disclosure relates to an electrolytic copper foil for graphene and a method for producing the copper foil. More particularly, the present disclosure relates to an electrolytic copper foil for graphene and a method for producing the copper foil, which may facilitate formation of graphene by blocking surface deformation during the electrolytic copper foil formation. In accordance with the present disclosure, the Rz roughness of the S-face of the electrolytic copper foil after 1 hour treatment at 200° C. in the synthesis of graphene on the electrolytic copper foil is defined based on the Relationship 1 below. This may also minimize the deformation of the surface of the electrolytic copper foil at high temperatures: 0.05?(Rz roughness of M-face of electrolytic copper foil/Rz roughness of S-face after treatment at 200° C. for 1 hour)/thickness of electrolytic copper foil?0.2.

Abstract: The present disclosure relates to an electrolytic copper foil for graphene and a method for producing the copper foil, in which, in the manufacture of the electrolytic copper foil for graphene, addition of nickel facilitates the synthesis of the graphene. The addition of nickel which serves as a seed in the synthesis of graphene on electrolytic copper foil reduces the electrical conductivity after graphene synthesis. As a result, graphene is uniformly formed on the surface of the copper foil. Further, the present disclosure may provide the electrolytic copper foil for graphene and the method for producing the copper foil in which an electrolytic copper foil having a resistance value of less than 300 ohm/square after the synthesis of the graphene on the electrolytic copper foil is produced, thereby, facilitate the formation of graphene on the electrolytic copper foil.

Abstract: Disclosed is an electrolytic copper foil obtained by heat treating a copper foil manufactured through electrolysis, the electrolytic copper foil having specific resistivity of 1.68 to 1.72 ??·cm and a grain mean diameter of a crystallite of 1.0 to 1.5 ?m.

Abstract: Disclosed is an electrolytic copper foil having specific resistivity of 1.68 to 1.72 ??·cm and a grain mean diameter of a crystallite less than 0.41 to 0.80 ?m.

Abstract: Disclosed herein is an electrolytic copper foil in which an average diameter of a pore which is a region between surface elements protruding from a matte side is 1 mm to 100 nm. The electrolytic copper foil has high elongation while maintaining low roughness and high strength and thus may be used in a current collector of a medium-large size lithium ion secondary battery and a semiconductor packaging substrate, and the like, for tape automated bonding (TAB) which is used in a tape carrier package (TCP).

Abstract: Disclosed is an electrolytic copper foil obtained by heat treating a copper foil manufactured through electrolysis, the electrolytic copper foil having specific resistivity of 1.68 to 1.72 ??·cm and a grain mean diameter of a crystallite of 1.0 to 1.5 ?m.

Abstract: Disclosed is an electrolytic copper foil having specific resistivity of 1.68 to 1.72 ??·cm and a grain mean diameter of a crystallite less than 0.41 to 0.80 ?m.

Abstract: Disclosed is an electrodeposited copper foil, in which a center line roughness average Ra (?m), a maximum height Rmax (?m), and a ten-point height average Rz (?m) of a matte side satisfy an Equation below, 1.5?(Rmax?Rz)/Ra?6.5. The electrodeposited copper foil according to the present invention maintains low roughness and high strength, and exhibits a high elongation rate, and particularly, has excellent glossiness, so that the electrodeposited copper foil may be used in a current collector of a medium and large lithigum ion secondary battery and a semiconductor packaging substrate for Tape Automated Bonding (TAB) used in a Tape Carrier Package (TCP).

Abstract: Disclosed herein is a complex, wherein micelles and/or liposomes dispersed in hyaluronic acids and/or hyaluronic acid derivatives, with a drug and/or functional material loaded in the micelles and/or the liposomes. The complex can release the drug and/or functional material in a controlled manner. Also, a multilayer using the complex, and a device coated with the multilayer are disclosed herein.