Abstract: Embodiments of the subject invention relate to a method and apparatus for shipping products so as to control the temperatures the products are exposed to. Embodiments can increase the amount of time the product and/or portions of the product experience a desired temperature range and/or reduce the amount of time the product and/or portions of the product experience temperatures outside of the desired temperature range and/or experience an undesirable temperature range. Embodiments can incorporate biotic materials, such as wood fibers or moss, positioned around and/or near the product positioned inside a packaging container or around a pallet load, such that the biotic materials restrict heat flow from one or more locations on the exterior of the package to one or more other locations in the interior of the package.

Abstract: Method and apparatus for thermally protecting a product, when storing and/or shipping a product, to control temperatures products are exposed to. Embodiments increase the amount of time portions of the product experience a desired temperature range and/or reduce the amount of time portions of the product experience temperatures outside a desired temperature range and/or experience an undesirable temperature range. Embodiments incorporate thermally conductive materials, referred to as conductive equalizers, positioned around and/or near the product positioned inside a packaging container, where the conductive materials conduct heat from locations in the package interior to other locations in the package interior.

Abstract: Method and apparatus for thermally protecting a product, when storing and/or shipping a product, to control temperatures products are exposed to. Embodiments increase the amount of time portions of the product experience a desired temperature range and/or reduce the amount of time portions of the product experience temperatures outside a desired temperature range and/or experience an undesirable temperature range. Embodiments incorporate thermally conductive materials, referred to as conductive equalizers, positioned around and/or near the product positioned inside a packaging container, where the conductive materials conduct heat from locations in the package interior to other locations in the package interior.

Abstract: Embodiments of the subject invention relate to a method and apparatus for thermally protecting a product, such as when storing and/or shipping a product, so as to control the temperatures the products are exposed to. Embodiments can increased the amount of time the product and/or portions of the product experience a desired temperature range and/or reduce the amount of time the product and/or portions of the product experience temperatures outside of the desired temperature range and/or experience an undesirable temperature range. Embodiments can incorporate thermally conductive materials, such as aluminum sheets, positioned around and/or near the product positioned inside a packaging container, such that the conductive materials conduct heat from one or more locations in the interior of the package to one or more other locations in the interior of the package. These thermally conductive materials can be referred to as conductive equalizers.

Abstract: Embodiments of the subject invention relate to a method and apparatus for thermally protecting a product, such as when storing and/or shipping a product, so as to control the temperatures the products are exposed to. Embodiments can increased the amount of time the product and/or portions of the product experience a desired temperature range and/or reduce the amount of time the product and/or portions of the product experience temperatures outside of the desired temperature range and/or experience an undesirable temperature range. Embodiments can incorporate thermally conductive materials, such as aluminum sheets, positioned around and/or near the product positioned inside a packaging container, such that the conductive materials conduct heat from one or more locations in the interior of the package to one or more other locations in the interior of the package. These thermally conductive materials can be referred to as conductive equalizers.

Abstract: Embodiments of the subject invention relate to a method and apparatus for thermally protecting a product, such as when storing and/or shipping a product, so as to control the temperatures the products are exposed to. Embodiments can increased the amount of time the product and/or portions of the product experience a desired temperature range and/or reduce the amount of time the product and/or portions of the product experience temperatures outside of the desired temperature range and/or experience an undesirable temperature range. Embodiments can incorporate thermally conductive materials, such as aluminum sheets, positioned around and/or near the product positioned inside a packaging container, such that the conductive materials conduct heat from one or more locations in the interior of the package to one or more other locations in the interior of the package. These thermally conductive materials can be referred to as conductive equalizers.