Abstract: A method for the continuous selective electroplating of a metallic substrate material (10) and more particularly of a substrate material band having prestamped contact elements, comprises the following steps: a) the substrate material (10) is coated in an electrophoretic coating means (14) with an electrophoretic coating composition selective with at least one composition strip, b) the at least one composition strip is removed at those parts by means of a laser (40), which are to be electroplated, c) in an electroplating process a metal layer is applied to the areas (42) deprived of composition in at least one composition strip using selective electroplating and d) the at least one composition strip is then removed.