Abstract: The present invention relates to a dry cleaning technology for a cleaning a surface of an object to be cleaned by adiabatically expanding liquid carbon dioxide to generate sublimable dry ice particles and carrying the dry ice particles on high-speed carrier gas to be sprayed onto the surface of the object to be cleaned, wherein an end of a liquid carbon dioxide nozzle further protrudes to the outside relative to an end of a carrier gas nozzle to prevent a growth of dry ice particles in the carrier gas nozzle, a hydrophobic coating is formed on a surface of the liquid carbon dioxide nozzle to prevent a formation of water droplets and to prevent an occurrence of irregular dry ice particles, thereby effectively preventing damage to a surface of an object to be cleaned and being advantageous in an economical aspect by significantly reducing consumption of liquid carbon dioxide.

Abstract: A wafer test machine is disclosed. The wafer test machine comprises a main body having a chamber defined therein, wherein a probe card is disposed at an upper portion of the chamber; a chuck for fixing a wafer in the chamber; a moving unit for moving the chuck in the chamber, thus making a contact between the probe card and the wafer; and a laser cleaning apparatus for cleaning the probe card in the chamber using a laser beam, when the probe card does not contact the wafer.

Abstract: A laser cleaning apparatus for removing a surface pollutant on a large-area mask uniformly over an entire surface thereof is disclosed. The laser cleaning apparatus includes a laser generator; and a laser scanner for receiving a laser beam from the laser generator and scanning a surface of the mask with the laser beam using a movable end scanning mirror. The laser scanner includes a distance compensation device for maintaining a constant transmission distance of the laser beam between the lager generator and the surface of the mask.

Abstract: Disclosed is a dry cleaning apparatus and method for removing contaminants on a surface of a workpiece. The disclosed dry cleaning apparatus comprises a laser cleaning unit having a laser beam generator for generating a laser induced shock wave in the atmosphere, the laser cleaning unit being suitable for removing an inorganic contaminant on the surface of the workpiece using the generated laser induced shock wave; and a flash cleaning unit having a flash generator for generating a flash having pulse wave, the flash cleaning unit being suitable for removing an organic contaminant on the surface of the workpiece using the generated flash.

Abstract: Disclosed is a dry cleaning apparatus and method for removing contaminants on a surface of a workpiece. The disclosed dry cleaning apparatus comprises a laser cleaning unit having a laser beam generator for generating a laser induced shock wave in the atmosphere, the laser cleaning unit being suitable for removing an inorganic contaminant on the surface of the workpiece using the generated laser induced shock wave; and a flash cleaning unit having a flash generator for generating a flash having pulse wave, the flash cleaning unit being suitable for removing an organic contaminant on the surface of the workpiece using the generated flash.

Abstract: A dry surface cleaning apparatus removes surface contaminants on a surface of a workpiece. The dry surface cleaning apparatus has a laser for generating a laser beam, a sealed chamber for holding the workpiece therein, wherein the sealed chamber has a transparent window through which the laser beam is transmitted, and a laser focusing lens for converging the laser beam on a laser focus around the surface of the workpiece to generate a plasma shock wave around the laser focus.

Abstract: A dry surface cleaning apparatus removes surface contaminants on a surface of a workpiece. The dry surface cleaning apparatus includes a laser for generating a laser beam, a beam delivery control unit for splitting the laser beam into a first and a second laser beam, a frequency modulator for modulating the second laser beam to generate a shorter wavelength laser beam and a laser focusing lens for converging the first laser beam on a laser focus around the surface of the workpiece to generate a plasma shock wave around the laser focus.