Abstract: A semiconductor device includes a substrate, a first land formed in a first surface of the substrate, a second land formed in a second surface of the substrate, a first terminal coupled to the second land, a line coupled to the first land and the second land, a second terminal formed in the second surface of the substrate and a branch line coupled to the line and the second terminal. The second terminal is coupled to the first land and the second land and is not coupled to other lands in the first surface. The second surface is different surface from the first surface.

Abstract: A pop-free single-ended output class-D amplifier includes: an input signal generator for generating an input signal; a power supply for supplying input power; a reference voltage generator for generating a reference voltage; a gain-adjustable stage for generating an amplified signal according to the reference voltage and adjusting a gain of the single-ended output class-D amplifier; a pulse width modulation module for outputting a pulse width modulation signal according to the reference voltage, the amplified signal, and the input power; a low-pass filter for low-pass filtering the pulse width modulation signal to generate an output voltage; and a logic controller for generating at least one control signal to control the reference voltage generator, the gain-adjustable stage, and the pulse width modulation module according to the input power, the reference voltage, and the pulse width modulation signal.

Abstract: The present invention provides a DIN jack including a dielectric shroud defining a closed entry lead-in that helps prevent damage caused by a bent or misaligned signal pin of a mating DIN plug without adversely affecting the performance of the DIN connector. The present invention also provides a board lock feature that may be used to hold a DIN jack securely to a circuit board during the manufacturing process.

Abstract: Methods for manufacturing multiple bottom port, surface mount microphones, each containing a micro-electro-mechanical system (MEMS) microphone die, are disclosed. Each surface mount microphone features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The surface mount microphones are manufactured from panels of substrates, sidewall spacers, and lids. Each MEMS microphone die is substrate-mounted and acoustically coupled to the acoustic port disposed in the substrate. The panels are joined together, and each individual substrate, sidewall spacer, and lid cooperate to form an acoustic chamber for its respective MEMS microphone die. The joined panels are then singulated to form individual MEMS microphones.

Abstract: A terahertz interaction circuit is provided. The terahertz interaction circuit includes a waveguide and an electron beam tunnel. The waveguide has a folded shape and in which an electromagnetic wave propagates. The electron beam tunnel is formed to penetrate through the waveguide. An electron beam passes through the electron beam tunnel. The waveguide includes a ridge portion in which a portion of a surface of the waveguide protrudes into the waveguide.

Abstract: A waterproof controller used for electric power steering includes a shell, a chamber, at least one sealing block, a circuit board, at least one cable, and at least one board mounting accessory. The chamber is formed in the shell. The sealing block is disposed on the shell, and includes at least one hole. The circuit board is accommodated in the chamber. The cable includes a first terminal and a second terminal opposite to the first terminal. The first terminal passes through the hole of the sealing block. The board mounting accessory covers the second terminal, in which the board mounting accessory and the second terminal insert into the circuit board together.

Abstract: The stack package includes a first semiconductor package and a second semiconductor package. The first semiconductor package includes a first substrate having a first modulus and at least one semiconductor chip mounted on the first substrate. The second semiconductor package stacked on the first semiconductor package and includes a second substrate having a second modulus and at least one semiconductor chip mounted on the second substrate. The second modulus is less than the first modulus. Even in the event that the first semiconductor package is under severe warpage due to a temperature change, the flexible second substrate, which includes e.g., polyimide or poly ethylene terephthalate, of the second semiconductor package may be less sensitive to the temperature change, thereby improving reliability of the stack package.

Abstract: An IO port usable with an electronic apparatus to allow an external device to be connected thereto includes a plurality of signal pins disposed to exchange signals between the external device and the electronic apparatus, and at least one discharge pin disposed to be electrically connected to the external device ahead of the plurality of signal pins when the external device is connected to the IO port, and to discharge at least a portion of static electricity accumulated in the external device.

Abstract: Provided are a radio frequency identification (RFID) tag and a method for receiving a signal of the RFID tag. The RFID tag includes a voltage generator configured to generate a voltage signal from a received signal, a common gate circuit configured to convert the voltage signal into a current signal, a current/voltage converter configured to the current signal into a voltage signal by using a resistance value, a low-pass filter configured to perform low-pass filtering on the converted voltage signal, a buffer configured to buffer the low-pass-filtered voltage signal within an operation range, and a peak detector configured to detect a peak value from the buffered signal to demodulate information data. The current/voltage converter controls the resistance value to convert the current signal into a voltage signal included within the operation range of the buffer.

Abstract: Provided are a clipping apparatus and clipping method for a three-dimensional (3D) graphic rendering. The clipping apparatus may reset or convert a triangular object based on distance information of vertices configuring or comprising the triangular object where a perspective projection scheme is applied.

Abstract: A unit pixel of an image sensor includes a photoelectric conversion region, an isolation region, a floating diffusion region and a transfer gate. The photoelectric conversion region is formed in a semiconductor substrate. The isolation region surrounds the photoelectric conversion region, extends substantially vertically with respect to a first surface of the semiconductor substrate, and crosses the incident side of the photoelectric conversion region so as to block leakage light and diffusion carriers. The floating diffusion region is disposed in the semiconductor substrate above the photoelectric conversion region. The transfer gate is disposed adjacent to the photoelectric conversion region and the floating diffusion region, extends substantially vertically with respect to the first surface of the semiconductor substrate, and transmits the photo-charges from the photoelectric conversion region to the floating diffusion region.

Abstract: A device including one or more layers with lateral regions configured to facilitate the transmission of radiation through the layer and lateral regions configured to facilitate current flow through the layer is provided. The layer can comprise a short period superlattice, which includes barriers alternating with wells. In this case, the barriers can include both transparent regions, which are configured to reduce an amount of radiation that is absorbed in the layer, and higher conductive regions, which are configured to keep the voltage drop across the layer within a desired range.

Abstract: The present disclosure provides methods and devices for testing a connection between speakers and a power amplifier. The disclosed methods and devices solve a problem that, upon a connection test for a power amplifier which has a booster power source, when a midpoint potential of the power amplifier and the voltage of the speaker connection terminal are compared, and it is determined that short-circuiting occurs on a ground side when the potential of the speaker connection terminal is lower than the midpoint potential, a wrong test is conducted if a midpoint potential is higher than a battery voltage.

Abstract: A method for performing zone switch carried out by an advanced mobile station (AMS) operating in a first zone of a serving advanced base station (serving ABS) supporting a legacy mobile station (MS). The method includes receiving a handover command (AAI-HO-CMD) message indicating zone switching to a second zone of the serving ABS from the first zone, in which the handover command message is received in the first zone and provides information on a Connection Identifier (CID) to be used by the AMS in the second zone; performing network reentry in the second zone using the information on the CID; receiving an unsolicited ranging response (RNG-RSP) message in the second zone after the network reentry in the second zone is finished, in which the unsolicited RNG-RSP message indicates zone switching to the first zone of the serving ABS from the second zone; and performing network reentry in the first zone of the serving ABS. Further, the first zone supports AMSs and the second zone supports legacy MSs.

Abstract: A Montgomery inverse calculation device includes a plurality of registers each storing a value of a variable, a modulus register storing a modulus, a multiplier performing multiplication on the modulus. A comparator compares the value of the variable stored in each of the registers with an output value of the multiplier and generates a plurality of control signals. A plurality of shifters shifts bits of a value of a variable stored in a corresponding register among the registers in response to at least one first control signal, and a quotient generation block calculates a quotient of mod 2m with respect to values output from some of the shifters in response to a second control signal. A calculation block calculates an updated value of an output value of each of the shifters using the quotient in response to at least one third control signal.

Abstract: An electrophotographic image forming apparatus and a development cartridge are provided. The electrophotographic image forming apparatus includes a body including an opening, a photoreceptor cartridge attached to, or detached from, the body through the opening, a photoconductive drum and a mounting portion, a development cartridge attached to, or detached from, the mounting portion through the opening while the photoreceptor cartridge is mounted in the body, a development roller supplying toner to an electrostatic latent image formed on the photoconductive drum, a cover for opening or closing the opening, and a pressurizing unit fixing the development cartridge to the mounting portion by providing a pressing force to the development cartridge in a direction parallel to a center line connecting centers of the photoconductive drum and development roller while the opening is closed.

Abstract: Disclosed are an optical waveguide platform with integrated active transmission device and monitoring photodiode. The optical waveguide platform with hybrid integrated optical transmission device and optical active device includes an optical waveguide region formed by stacking a lower cladding layer, a core layer and an upper cladding layer on a substrate; a trench region formed by etching a portion of the optical waveguide region; and a spot expanding region formed on the core layer in the optical waveguide region, in which the optical transmission device is mounted in the trench region and the optical active device is flip-chip bonded to the spot expanding region. The monitoring photodiode is flip-chip bonded to the spot expanding region of the core layer of the optical waveguide, thereby monitoring output light including an optical coupling loss that occurs during flip-chip bonding.