Patents Assigned to IN2TEC LIMITED
  • Recyclable circuit assembly
    Patent number: 9706693
    Abstract: An electronic circuit assembly comprises a substrate and circuit components attached to the substrate by means of an electrically conductive adhesive, wherein the adhesive is releasable under predetermined release conditions, whereby to enable the circuit components to be removed from the substrate for recovery or re-use.
    Type: Grant
    Filed: January 25, 2013
    Date of Patent: July 11, 2017
    Assignees: IN2TEC LIMITED, NPL MANAGEMENT LIMITED, GWENT ELECTRONIC MATERIALS LIMITED
    Inventors: Christopher Hunt, John Lewison, Robin Pittson