Abstract: A configurable memory system and method is wherein an integrated circuit coupled to a memory device includes application logic and memory interface logic in communication with the application logic, the memory interface logic configured to access a memory array within the memory device. The memory interface logic provides logic functions and/or signals that would have been provided by logic on a prior art memory device. The interface logic may access the memory device synchronously or asynchronously. The integrated circuit may communicate to the memory device using multiplexed or non-multiplexed signals.

Abstract: A system is provided for testing a first integrated circuit associated with at least a second integrated circuit in a semiconductor device, wherein at least some external terminals for the semiconductor device are to be shared by the first and second integrated circuits, and wherein the first integrated circuit is designed for normal operation and a test mode. The system includes a plurality of multiplexer circuits. Each multiplexer circuit is operable to receive a respective signal from the second integrated circuit when the first integrated circuit is in normal operation. Each multiplexer circuit is further operable to receive a respective signal from either the second integrated circuit or an associated external terminal when the first integrated circuit is in test mode. An external terminal of the semiconductor device operable to receive a signal for causing the first integrated circuit to transition between normal operation and the test mode.

Abstract: Systems and methods of testing integrated circuits are disclosed. The systems include a test module configured to operate between an automated testing equipment and an integrated circuit to be tested. The testing interface is configured to test the integrated circuit at a higher clock frequency than the automated testing equipment is configured to operate. In order to do so, the testing interface includes components configured for generating addresses and test data to be provided to the integrated circuit. A variety of test data patterns can be produced and the test data can be address dependent.

Abstract: In one embodiment, the present invention provides a platform of hardware and/or software that enables the complete access and reliable testing of multiple integrated circuit (IC) devices within a package. This platform may include a testing component (e.g., test circuits, test pads, shared pads, etc.), one or more probe cards and related hardware, wafer probe programs, load board and related hardware of external test equipment, and software and routines for final test programs.

Abstract: A system is provided for testing a logic device and an integrated circuit disposed within a semiconductor device package. The logic device may be configured to operate in at least a normal mode and a test mode. A terminal external to the semiconductor device package may be electronically coupled to the logic device and the integrated circuit. The terminal may be configured to operate as a shared input for the logic device and the integrated circuit. A multiplexer circuit may be configured to convey a first signal from the terminal to the logic device in the test mode, to convey a second signal from the integrated circuit to the logic device in the normal mode, and to receive a third signal from the integrated circuit for causing a transition between the normal mode and the test mode.

Abstract: Disclosed are systems and methods of producing electronic devices. These electronic devices include excess circuits to be used as replacements for circuits that are found to be defective within the electronic device. The excess circuits are included in a different device component than the circuits that are found to be defective. The replacement process occurs after the excess circuits and defective circuits are included in an electronic device including the different device components. Identification of the defective circuits may occur before or after the defective circuits are incorporated in the electronic device. In some embodiments, systems and methods of the invention result in improved manufacturing yields as compared with the prior art.

Abstract: Systems and methods of testing integrated circuits are disclosed. The systems include a test module configured to operate between automated testing equipment and an integrated circuit to be tested. The testing interface is configured to test the integrated circuit at a higher clock frequency than the automated testing equipment is configured to operate. In order to do so, the testing interface includes components configured for generating addresses and test data to be provided to the integrated circuit. A variety of test data patterns can be produced and the test data can be address dependent.

Abstract: Systems and methods of testing integrated circuits are disclosed. The systems include a test module configured to operate between an automated testing equipment and an integrated circuit to be tested. The testing interface is configured to test the integrated circuit at a higher clock frequency than the automated testing equipment is configured to operate. In order to do so, the testing interface includes components configured for generating addresses and test data to be provided to the integrated circuit. A variety of test data patterns can be produced and the test data can be address dependent.

Abstract: In a first integrated circuit chip contained in a single package along with a second integrated circuit chip, a system includes circuitry on the first integrated circuit chip for receiving address signals from the second integrated circuit chip during normal operation. Circuitry on the first integrated circuit chip generates address signals for use in testing the first integrated chip in a test mode.

Abstract: Systems and methods of testing integrated circuits are disclosed. The systems include a test module configured to operate between an automated testing equipment and an integrated circuit to be tested. The testing interface is configured to test the integrated circuit at a higher clock frequency than the automated testing equipment is configured to operate. In order to do so, the testing interface includes components configured for generating addresses and test data to be provided to the integrated circuit. A variety of test data patterns can be produced and the test data can be address dependent.

Abstract: A system is provided for testing a first integrated circuit chip associated with at least a second integrated circuit chip in a semiconductor device, wherein at least some external terminals for the semiconductor device are to be shared by the first and second integrated circuit chips, and wherein the first integrated circuit chip is designed for normal operation and a test mode. The system includes a plurality of multiplexer circuits. Each multiplexer circuit is operable to receive a respective signal from the second integrated circuit chip when the first integrated circuit chip is in normal operation. Each multiplexer circuit is further operable to receive a respective signal from either the second integrated circuit chip or an associated external terminal when the first integrated circuit chip is in test mode. An external terminal of the semiconductor device operable to receive a signal for causing the first integrated circuit chip to transition between normal operation and the test mode.

Abstract: Systems and methods of testing integrated circuits are disclosed. The systems include a test module configured to operate between an automated testing equipment and an integrated circuit to be tested. The testing interface is configured to test the integrated circuit at a higher clock frequency than the automated testing equipment is configured to operate. In order to do so, the testing interface includes components configured for generating addresses and test data to be provided to the integrated circuit. A variety of test data patterns can be produced and the test data can be address dependent.

Abstract: Systems and methods for synchronizing communication between devices include using a test circuit to measure a propagation time through a delay circuit. The propagation time is used to determine an initial delay value within a delay lock loop. This delay value is then changed until a preferred delay value, resulting in synchronization, is found. In various embodiments, used of the initial delay value increases the speed, reliability or other beneficial features of the synchronization.

Abstract: Systems and methods of testing integrated circuits are disclosed. The systems include a test module configured to operate between an automated testing equipment and an integrated circuit to be tested. The testing interface is configured to test the integrated circuit at a higher clock frequency than the automated testing equipment is configured to operate. In order to do so, the testing interface includes components configured for generating addresses and test data to be provided to the integrated circuit. A variety of test data patterns can be produced and the test data can be address dependent.

Abstract: In one embodiment, a first integrated circuit (IC) chip may comprise one or more bonding pads to which bonding wires from respective external leads may be connected. Other bonding wires connect the same bonding pads on the first IC chip to a second IC chip. This can be used, for example, to reduce the need for connections integral to the first IC chip for routing the signals received over the bonding wires internally in the first IC chip to the second IC chip.

Abstract: A system is provided for communicating with a device within a packaged semiconductor device through a shared external terminal thereof. As one example, the system provides for testing a memory within the package. In addition to the device and the shared external terminal, the system includes a command register that receives a plurality of command signals, and digital logic devices coupled between the external terminal and the command register. Each of the digital logic devices receives a different clock signal and outputs one of the command signals to the command register. The command signals are provided to the external terminal in a sequence that is coordinated with the clock signals so that each digital logic device buffers one of the command signals.

Abstract: A semiconductor memory chip is provided for packaging along with a system chip in a single semiconductor package having a plurality of external connectors. The memory chip includes a memory storage array for storing data. A plurality of data buffers is provided for writing or reading data between said memory storage array and the system chip within the single semiconductor package. A first power level may be used for each of the plurality of data buffers. At least one test buffer is directly connected to certain of said plurality of external connectors for supporting testing of said memory chip within the single semiconductor package by external test equipment. A second power level may be used for the test buffer.

Abstract: A method for driving a data signal across a data bus consists of charging the data bus to a first voltage level prior to driving the signal, maintaining the data bus at the first voltage level when a first type of data signal is to be driven, and pulling the data bus to a second voltage level when a second type of data signal is to be driven. A system for driving a data signal consists of a data bus, a charging circuit coupled to the data bus configured to charge the data bus to a first voltage level, a keeper circuit coupled to the data bus configured to maintain the data bus at the first voltage level after the charging circuit has charged the data bus, and a pull-down circuit coupled to the data bus configured to pull the data bus to a second voltage level.

Abstract: A system and method is provided for testing a secondary chip housed within a multi-chip packaged semiconductor device. The packaged semiconductor device includes a secondary chip and a primary chip, with the secondary chip communicating with the primary chip through signal drivers. The secondary chip also includes at least one test signal driver connected to the signal drivers and to certain external connectors that may be shared with the primary chip. The test signal drivers provide testing of the secondary chip using standard integrated circuit test equipment while the secondary chip is contained within the packaged semiconductor device.

Abstract: In one embodiment, a method is provided for monitoring signals communicated between a first integrated circuit chip and a second integrated circuit chip within a single packaged semiconductor device, wherein at least some external terminals for the packaged semiconductor device are shared by the first and second integrated circuit chips. The method includes the following: receiving signals from the first integrated circuit chip at a plurality of bond pads on the second integrated circuit chip; selecting a portion of the received signals; and outputting the selected portion of the received signals from the single packaged semiconductor device.