Patents Assigned to Inari Semiconductor Labs Sdn Bhd
  • Ultra-thin thermally enhanced electro-magnetic interference shield package
    Patent number: 10600743
    Abstract: A method to fabricate an electronic package is described and includes the steps of: connecting a plurality of semiconductor chips to at least one surface of a substrate using a connect pad; encapsulating the semiconductor chips with a non-conductive material; and forming an electro-magnetic interference shield layer over the encapsulated semiconductor chip.
    Type: Grant
    Filed: September 12, 2018
    Date of Patent: March 24, 2020
    Assignee: Inari Semiconductor Labs Sdn Bhd
    Inventors: Ching-Fong Lee, Heap-Hooi Nyeo, Chin-Chooi Ch'ng, Ooi-Lin Cheng
  • ULTRA-THIN THERMALLY ENHANCED ELECTRO-MAGNETIC INTERFERENCE SHIELD PACKAGE
    Publication number: 20190139902
    Abstract: A method to fabricate an electronic package is described and includes the steps of: connecting a plurality of semiconductor chips to at least one surface of a substrate using a connect pad; encapsulating the semiconductor chips with a non-conductive material; and forming an electro-magnetic interference shield layer over the encapsulated semiconductor chip.
    Type: Application
    Filed: September 12, 2018
    Publication date: May 9, 2019
    Applicant: Inari Semiconductor Labs Sdn Bhd
    Inventors: Ching-Fong Lee, Heap-Hooi Nyeo, Chin-Chooi Ch'ng, Ooi-Lin Cheng