Patents Assigned to Incep Technologies, Inc.
  • Method and apparatus for thermal and mechanical management of a power regulator module and microprocessor in contact with a thermally conducting plate
    Patent number: 6452804
    Abstract: A stack up assembly for supplying power and removing heat from a microprocessor while controlling electromagnetic emissions is disclosed. The stack up assembly comprises a VRM circuit board or power regulation module, having a first side and a second side; a thermally conductive plate such as a vapor plate having a first side and a second side, wherein the thermally conductive plate first side is thermally coupled to the second side of the VRM circuit board; and a microprocessor having a first side and a second side, the microprocessor first side thermally coupled to the vapor plate second side.
    Type: Grant
    Filed: March 8, 2001
    Date of Patent: September 17, 2002
    Assignee: INCEP Technologies, Inc.
    Inventors: Joseph T. Dibene, II, David H. Hartke
  • Inter-circuit encapsulated packaging
    Publication number: 20010038527
    Abstract: An encapsulated circuit assembly and a method for making an encapsulated circuit assembly are disclosed. The assembly comprises a first printed circuit board, a second printed circuit board, and a heat transfer device. The second printed circuit board comprises a heatsink, and the heat transfer device couples between a device mounted on the first printed circuit board and the second printed circuit board for transferring heat from the device to the heatsink of the second printed circuit board.
    Type: Application
    Filed: June 19, 2001
    Publication date: November 8, 2001
    Applicant: INCEP Technologies, Inc.
    Inventors: Joseph Ted DiBene, David Hartke
  • Inter-circuit encapsulated packaging
    Patent number: 6304450
    Abstract: An encapsulated circuit assembly and a method for making an encapsulated circuit assembly are disclosed. The assembly comprises a first printed circuit board, a second printed circuit board, and a heat transfer device. The second printed circuit board comprises a heatsink, and the heat transfer device couples between a device mounted on the first printed circuit board and the second printed circuit board for transferring heat from the device to the heatsink of the second printed circuit board.
    Type: Grant
    Filed: July 15, 1999
    Date of Patent: October 16, 2001
    Assignee: INCEP Technologies, Inc.
    Inventors: Joseph Ted Dibene, II, David Hartke