Abstract: A method for making an electrowetting device includes: (a) forming a surrounding wall on an upper surface of a substrate to surround a microchamber, the surrounding wall having an inner surface surrounding the microchamber and a top surface above the inner surface, the upper surface of the substrate being non-hydrophobic; (b) coating the surrounding wall and the upper surface of the substrate with a hydrophobic coating material; (c) removing a portion of the hydrophobic coating material formed on the top surface of the surrounding wall, thereby exposing the top surface of the surrounding wall; and (d) disposing a liquid into the microchamber.