Abstract: A multilayer stack comprises a surface wherein a predetermined region is defined for enclosing a device provided on the multilayer stack, the region being encircled by a welding zone defined on the surface, the welding zone being suitable for being welded by a welding radiation beam to a capping structure. It also comprises a first layer embedded within the multilayer stack, including at least one embedded component suitable for being functionally connected to the device provided on the multilayer stack. It furthermore comprises at least a second layer over the first layer comprising a shielding structure positioned between the at least one component of the first layer and the welding zone defined on the surface, the shielding structure being adapted to limit the welding depth of the welding radiation beam provided on the welding zone.

Abstract: A sensing system comprises a photonics integrated circuit partially encapsulated by an encapsulation material and the photonics integrated circuit comprising a first integrated sensor accessible to a target analyte and being positioned in a part of the photonics integrated circuit not being encapsulated by an encapsulation material, and a second integrated sensor accessible to a reference substance and being positioned in a part of the photonics integrated circuit that is encapsulated by an encapsulation material. The sensing system is further adapted to, when in use, comprise the reference substance but less or no target analyte between the second integrated sensor and the encapsulation material as compared to the amount of target analyte being present at the first integrated sensor.

Abstract: A method for encapsulating a sensing and/or actuator device, comprises the steps of providing a sensing and/or actuator device having a demarcation structure thereon. The sensing and/or actuator device comprises at least a substrate and a sensing and/or actuator element on the substrate. The demarcation structure contacts the substrate and defines an enclosed area of the substrate. The enclosed area comprises at least the sensing and/or actuator element. The method also comprises providing an encapsulation material outside the enclosed area, so the sensing and/or actuator element is left uncovered by the encapsulation material. The demarcation structure further comprises a capping structure overlaying the sensing and/or actuator element.

Abstract: A sensor for sensing a substance such as for example glucose. The sensor is implantable in the body of a living creature. The sensor has a photonic integrated circuit, e.g. silicon-photonics integrated circuit, for spectrally processing radiation interacting with the sample. A continuous monitoring system can also include such a sensor.