Patents Assigned to Inductive Intelligence, LLC
  • Patent number: 11317480
    Abstract: Various smart package configurations may include a package intelligence and communication module (PICM) intelligently interacting with smart heating appliances and users. A thermodynamic load profile may correlate thermodynamic response characteristics of the package and be stored in or associated with a unique identifier in the PICM. The TLP enables efficient and safe heating of packages on a smart appliance as well as package validation and authentication. Package configurations also include structural elements for efficient heating of food, beverage, cosmetic and personal care products.
    Type: Grant
    Filed: October 3, 2019
    Date of Patent: April 26, 2022
    Assignee: Inductive Intelligence, LLC
    Inventors: Gregory L. Clark, David W. Baarman
  • Patent number: 11019690
    Abstract: A smart inductive heating appliance includes an interface for interacting with a package intelligence and communication module on a smart package. The smart heating appliance may also detect and charge chargeable devices inductively. A number of data sets may be utilized to enhance control of heating/cooking and to enhance safety. A thermodynamic load profile of the package may include detailed data correlations established in a package testing step and utilized to control heating of the package as well as to validate and authenticate the package.
    Type: Grant
    Filed: December 23, 2019
    Date of Patent: May 25, 2021
    Assignee: Inductive Intelligence, LLC
    Inventors: Gregory L. Clark, David W. Baarman
  • Patent number: 10555380
    Abstract: A smart inductive heating appliance includes an interface for interacting with a package intelligence and communication module on a smart package. The smart heating appliance may also detect and charge chargeable devices inductively. A number of data sets may be utilized to enhance control of heating/cooking and to enhance safety. A thermodynamic load profile of the package may include detailed data correlations established in a package testing step and utilized to control heating of the package as well as to validate and authenticate the package.
    Type: Grant
    Filed: March 28, 2018
    Date of Patent: February 4, 2020
    Assignee: Inductive Intelligence, LLC
    Inventors: Gregory L. Clark, David W. Baarman
  • Patent number: 10477627
    Abstract: Various smart package configurations may include a package intelligence and communication module (PICM) intelligently interacting with smart heating appliances and users. A thermodynamic load profile may correlate thermodynamic response characteristics of the package and be stored in or associated with a unique identifier in the PICM. The TLP enables efficient and safe heating of packages on a smart appliance as well as package validation and authentication. Package configurations also include structural elements for efficient heating of food, beverage, cosmetic and personal care products.
    Type: Grant
    Filed: March 28, 2018
    Date of Patent: November 12, 2019
    Assignee: Inductive Intelligence, LLC
    Inventors: Gregory L. Clark, David W. Baarman