Abstract: A semiconductor processing system includes: an RF power supply which generates and supplies RF power; a plasma chamber which receives the RF power from the RF power supply; and an impedance matching circuit which is arranged between the RF power supply and the plasma chamber and matches output impedance to the plasma chamber. The impedance matching circuit includes a plurality of electrical variable capacitor circuits. Each of the electrical variable capacitor circuits includes: a first node connected to one side of the RF power supply; a second node connected to the other side of the RF power supply; a variable capacitor connected to the first node; a PIN diode connected in parallel to the variable capacitor; a switch connected in series to the PIN diode; and an inductor connected in parallel to the variable capacitor and the switch.