Abstract: The object of the present invention is to provide an inexpensive biodegradable molding material which allows easy adjustment of the biodegradability of the material as a molding material, which undergoes 100% degradation within a fixed period following use in molded articles without requiring any excessively long time for degradation, which has a high heat resistance, and therefore, can be used to mold disposable food containers or foodstuff packaging trays which are steam-sterilizable, as well as planting pots which allow the transplantation of young plants, etc. into the soil together with the planting pots, which possesses water resistance, and which is superior in terms of material strength and moldability. 51 to 70 wt % powdered paper and 30 to 49 wt % biodegradable aliphatic polyester resin are mixed with a consideration of biodegradability, moldability and material strength, etc. in accordance with the application involved so as to obtain a biodegradable molding material.
Type:
Grant
Filed:
June 30, 1997
Date of Patent:
October 12, 1999
Assignee:
Industrial Technical R & D Laboratory, Inc.
Abstract: Disclosed is a parent material for wooden patterns which is made free of direction due to grain unlike in natural timber, stickiness caused by heat during cutting process unlike thermoplastic resin foam and micro-vibration due to foam, and which can prevent occurrence of distortion in the pattern made thereof, can afford so thick mold as more than 50 millimeter in spite of using wood flour as a base material and can be plated, and to provide a method of producing such a parent material. As base materials 50 to 70% by weight of 80 to 200 mesh wood flour and 30 to 50% by weight of a self-hardening resin constituted of a main resin, a hardening agent and an accelerator are used for kneading together and the mixture is subjected to molding under pressure at ordinary temperature so as to regulate water absorption to 3% or lower for every 24 hours for obtaining a product in specified size and in high density.
Type:
Grant
Filed:
September 23, 1992
Date of Patent:
March 22, 1994
Assignee:
Industrial Technical R&D Laboratory Inc.