Patents Assigned to Industrial Technology Reaserch Institute
  • MULTI-TIER CAPACITOR STRUCTURE, FABRICATION METHOD THEREOF AND SEMICONDUCTOR SUBSTRATE EMPLOYING THE SAME
    Publication number: 20090128993
    Abstract: A multi-tier capacitor structure has at least one multi-tier conductive layer. At least one conductive via passes through the multi-tier conductive layer. When currents flow through the conductive via, different current paths are presented in the conductive via in response to different current frequency; in other words, different inductor is induced. Therefore, a single plate capacitor structure has function of hierarchical decoupling capacitor effect.
    Type: Application
    Filed: July 15, 2008
    Publication date: May 21, 2009
    Applicant: Industrial Technology Reaserch Institute
    Inventors: Shih-Hsien Wu, Min-Lin Lee, Shinn-Juh Lai, Shur-Fen Liu