Patents Assigned to Industrial Technology
  • Patent number: 11989078
    Abstract: A vehicle control device and a method thereof are provided. A master processor and a slave processor simultaneously receive, monitor or process signals of a vehicle, a power management module monitors the master processor via a first watchdog signal, and the master processor monitors the slave processor via a second watchdog signal. When the power management module sends the first watchdog signal to the master processor and no response message is received, the power management module sends a first reset signal to reset the master processor, and when the master processor sends the second watchdog signal to the slave processor and no response message is received, the master processor sends a second reset signal to reset the slave processor. When the master processor and the slave processor are abnormal, a forced wake-up module outputs a high level signal to forcibly wake up the master processor and the slave processor.
    Type: Grant
    Filed: June 7, 2022
    Date of Patent: May 21, 2024
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yu-Long Wang, Nan-Hsiung Tseng, Yi-Lun Cheng
  • Publication number: 20240163570
    Abstract: A correction method for ill-exposed (IE) images, comprises the following steps. (1) A series of original images are captured. (2) The original images are classified as a set of first well-exposed (WE) images and IE images by utilizing a first computational model, according to a lightness distribution of each of the original images. The IE images have a plurality of exposure types including a back-lit (BL) type, an over-exposed (OE) type, and an under-exposed (UE) type. (3) The IE images are corrected to obtain a set of second WE images by utilizing a second computational model. A plurality of perceptual parameters and structural parameters of each of the IE images are extracted and then adjusted according to the BL, OE, and UE types respectively. (4) The first WE images and the second WE images are provided as a set of output images.
    Type: Application
    Filed: October 26, 2023
    Publication date: May 16, 2024
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventor: Te-Mei WANG
  • Publication number: 20240157496
    Abstract: A method for facilitating analysis of causes of machining defects is provided. The method is carried out by a computer system. The method includes the step of obtaining motion data and vibration acceleration data about the tip of a cutter mounted on a machine tool. The method further includes the step of obtaining time-frequency information about the vibration acceleration data by performing a time-frequency analysis on the vibration acceleration data. The method further includes the step of obtaining vibration-displacement data by normalizing the time-frequency information. The method further includes the step of obtaining amplitude-distribution data about the tip by synchronizing the motion data and the vibration-displacement data.
    Type: Application
    Filed: December 19, 2022
    Publication date: May 16, 2024
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chun-Ting CHEN, Jheng-Jie LIN, Chien-Chih LIAO, Jen-Ji WANG
  • Publication number: 20240164008
    Abstract: A molded electronic assembly including a circuit substrate, a plurality of electronic devices, and at least one patterned heat dissipation structure is provided. The circuit substrate includes a substrate and a circuit, where the substrate has a top surface, and the circuit has a plurality of signal contacts distributed on the top surface. The electronic devices are disposed on the circuit substrate, and each of the electronic devices has a plurality of device pins connected to the signal contacts. The at least one patterned heat dissipation structure corresponds to a signal contact of the signal contacts and starts from the corresponding signal contact and extends toward a plurality of directions on the top surface of the substrate.
    Type: Application
    Filed: November 10, 2023
    Publication date: May 16, 2024
    Applicant: Industrial Technology Research Institute
    Inventors: Li-Wei Yao, Hsiao-Fen Wei, Chung-Wei Wang, Shu-Wei Kuo
  • Publication number: 20240158677
    Abstract: An adhesive and a method for removing the adhesive are provided. The adhesive includes component (A) and component (B). Component (A) is a combination of a first acrylate resin and a first compound, a second acrylate resin, a combination of the first acrylate resin and the second acrylate resin, a combination of the second acrylate resin and the first compound, or a combination of the first acrylate resin, the second acrylate resin and the first compound. The first acrylate resin has an iodine value from 0 to 3. The second acrylate resin has an acrylate group, or methacrylate group. Component (B) is a near infrared sensitizer. The first compound has at least two reactive functional groups, wherein the reactive functional groups are acrylate group, methacrylate group, or a combination thereof.
    Type: Application
    Filed: June 16, 2023
    Publication date: May 16, 2024
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Shuang-Huei CHEN, Yao-Jheng HUANG, Te-Yi CHANG, Ming-Tzung WU
  • Publication number: 20240162114
    Abstract: A power module including at least one power device, an insulation thermally conductive layer, and a heat dissipation device is provided. The insulation thermally conductive layer has a patterned circuit layer. The power device is disposed on the patterned circuit layer and is electrically connected to the patterned circuit layer. The heat dissipation device includes a heat dissipation plate and a heat dissipation base. The heat dissipation plate has a first surface and a second surface opposite to each other, and the insulation thermally conductive layer is disposed on the first surface. The heat dissipation base is partially bonded to the heat dissipation plate, and a chamber is formed between the heat dissipation plate and the heat dissipation bases. The heat dissipation base has a plurality of first heat dissipation bumps located in the chamber.
    Type: Application
    Filed: February 9, 2023
    Publication date: May 16, 2024
    Applicant: Industrial Technology Research Institute
    Inventors: Shian-Chiau Chiou, Chun-Kai Liu, Po-Kai Chiu, Chih-Ming Tzeng, Yao-Shun Chen
  • Publication number: 20240162359
    Abstract: A backsheet of a solar cell module including a substrate, a first protection layer, and a second protection layer is provided. The substrate includes a first surface and a second surface opposite to each other. The first protection layer is disposed on the first surface of the substrate. The second protection layer is disposed on the second surface of the substrate, wherein the first protection layer and the second protection layer include a silicone layer. At least one of the first protection layer and the second protection layer includes diffusion particles, wherein the diffusion particles include zinc oxide, titanium dioxide modified with silicon dioxide, or a combination thereof. A thickness of the first protection layer and a thickness of the second protection layer are respectively 10 ?m to 30 ?m. A solar cell module including the backsheet is also provided.
    Type: Application
    Filed: January 9, 2023
    Publication date: May 16, 2024
    Applicant: Industrial Technology Research Institute
    Inventors: Chih-Kang Peng, Cheng-Hsuan Lin, Yu-Ling Hsu, Chun-Chen Chiang
  • Publication number: 20240162431
    Abstract: A core-shell particle includes a core having a chemical structure of Ti(1-x)M1xNb(2-y)M2yO(7-z)Qz, in which M1 is Li or Mg; M2 is Fe, Mn, V, Ni, Cr, or Cu; Q is F, Cl, Br, I, or S; x is 0 to 0.15; y is 0 to 0.15; and z is 0 to 2; and a shell layer wrapping at least a portion of the surface of the core, and the shell layer includes Cu, Nb, Ti, and O.
    Type: Application
    Filed: November 28, 2022
    Publication date: May 16, 2024
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Kuan-Yu KO, Chun-Chi TSENG, Chia-Erh LIU
  • Publication number: 20240160211
    Abstract: An automated guided vehicle (AGV) includes an image capturing device, a storage device, a fetching device, a driving device and a processor. The processor is configured to execute: controlling the AGV to move from a starting position to a target position according to a navigation coordinate system, the target position corresponding to the object to be fetched; capturing a depth image from the object to be fetched through the image capturing device; performing image recognition on the depth image to obtain reference pixel information; converting the reference pixel information to the navigation coordinate system according to a coordinate mapping algorithm to obtain a calibrated position; and determining an object-fetching route according to the target position and the calibrated position, and controlling the AGV to move according to the object-fetching route to fetch the object to be fetched.
    Type: Application
    Filed: December 26, 2022
    Publication date: May 16, 2024
    Applicant: Industrial Technology Research Institute
    Inventors: Ruei-Jhih Hong, Yong-Ren Li, Ta-Cheng Ma
  • Publication number: 20240164069
    Abstract: A ceramic substrate structure includes a ceramic board, a first conductive layer, a second conductive layer and a heat dissipation layer. The ceramic board has a first surface and a second surface opposite to each other. Each of the first surface and the second surface is a single surface extending continuously. The first conductive layer is mounted on the first surface of the ceramic board. The second conductive layer is mounted on the first surface of the ceramic board. The second conductive layer is adjacent to the first conductive layer and have different thicknesses. The heat dissipation layer is mounted on the second surface of the ceramic board. The heat dissipation layer includes a first heat dissipation portion corresponding to the first conductive layer and a second heat dissipation portion corresponding to the second conductive layer, and the second heat dissipation portion has a patterned region.
    Type: Application
    Filed: December 21, 2022
    Publication date: May 16, 2024
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yue-Zhen HUANG, Meng-Chi HUANG, Tune-Hune KAO, Min-Chieh CHOU, Jie-Chi CHEN
  • Publication number: 20240162455
    Abstract: A battery cell including a membrane electrode assembly, a cathode bipolar plate and an anode bipolar plate. The anode bipolar plate includes a metal layer and a thermally conductive layer. The metal layer is stacked on a side of the membrane electrode assembly that is located farthest away from the cathode bipolar plate. The metal layer has a bottom surface, a top surface, a first side surface and a second side surface. The bottom surface faces the membrane electrode assembly. The thermally conductive layer includes a first cover layer and two second cover layers. The first cover layer covers the top surface of the metal layer. The two second cover layers protrude from two opposite sides of the first cover layer, respectively. The two second cover layers at least partially cover the first side surface and the second side surface of the metal layer, respectively.
    Type: Application
    Filed: March 16, 2023
    Publication date: May 16, 2024
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chien-Ming LAI, Sung-Chun CHANG, Chiu-Ping HUANG, Li-Duan TSAI
  • Publication number: 20240157801
    Abstract: A method for estimating a flight time of a hydrogen fuel cell UAV (unmanned aerial vehicle) includes multiple steps performed by a controller: obtaining an internal pressure of a hydrogen tank by a pressure sensor installed on the hydrogen tank, calculating a remaining hydrogen volume according to the internal pressure and a capacity of the hydrogen tank, obtaining a reaction current value of the fuel cell, calculating a first hydrogen consumption rate according to the reaction current value, the number of a set of membrane electrodes connected in series and a Faraday constant, obtaining a second hydrogen consumption rate of a purge operation of an anode of the full cell; obtaining a hydrogen leakage rate of a stack of the fuel cell, and calculating the flight time according to the remaining hydrogen volume, the first hydrogen consumption rate, the second hydrogen consumption rate and the hydrogen leakage rate.
    Type: Application
    Filed: May 18, 2023
    Publication date: May 16, 2024
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Ching-Jung LIU, Yuh-Fwu CHOU, Ku-Yen KANG, Yin-Wen TSAI, Ching-Fang HO, Cheng-Hsien YU
  • Patent number: 11981573
    Abstract: A method for selectively chemically reducing CO2 to form CO includes providing a catalyst, and contacting H2 and CO2 with the catalyst to chemically reduce CO2 to form CO. The catalyst includes a metal oxide having a chemical formula of FexCoyMn(1-x-y)Oz, in which 0.7?x?0.95, 0.01?y?0.25, and z is an oxidation coordination number.
    Type: Grant
    Filed: July 3, 2023
    Date of Patent: May 14, 2024
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Kuo-Ching Wu, Hsi-Yen Hsu, Chao-Huang Chen, Yuan-Peng Du
  • Publication number: 20240155664
    Abstract: A method of logical channel prioritization and a device thereof are provided.
    Type: Application
    Filed: October 19, 2023
    Publication date: May 9, 2024
    Applicant: Industrial Technology Research Institute
    Inventors: Tzu-Jane Tsai, Chun-Yuan Chiu
  • Publication number: 20240151642
    Abstract: A terahertz wave detection chip includes a substrate and at least one detection structure. The detection structure is disposed on a surface of the substrate. The detection structure includes a metamaterial layer and a hydrophilic layer, and the hydrophilic layer is disposed on the metamaterial layer.
    Type: Application
    Filed: December 22, 2022
    Publication date: May 9, 2024
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yu-Tai LI, Kao-Chi LIN, Cho-Fan HSIEH, Teng-Chun WU
  • Publication number: 20240153068
    Abstract: A non-contact detection method for a nut is provided. The method includes the following steps. The nut is photographed to obtain a threaded hole image of the nut. A thread area comparison between the threaded hole image and a standard threaded hole image is performed. An area difference is obtained according to the result of the thread area comparison. Whether the nut is a good nut is determined according to the area difference.
    Type: Application
    Filed: January 6, 2023
    Publication date: May 9, 2024
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Wei-Shiang HUANG, Tsai-Ling KAO, Chun-Yi LEE, Jhe-Ruei LI
  • Publication number: 20240150656
    Abstract: A liquid crystal polymer, composition, liquid crystal polymer film, laminated material and method of forming liquid crystal polymer film are provided. The liquid crystal polymer includes a first repeating unit, a second repeating unit, a third repeating unit, a fourth repeating unit, and a fifth repeating unit. The first repeating unit has a structure of Formula (I), the second repeating unit has a structure of Formula (II), the third repeating unit has a structure of Formula (III), the fourth repeating unit has a structure of Formula (IV), and the fifth repeating unit has a structure of Formula (V), a structure of Formula (VI), or a structure of Formula (VII) wherein A1, A2, A3, A4, X1, Z1, R1, R2, R3 and Q are as defined in the specification.
    Type: Application
    Filed: September 22, 2023
    Publication date: May 9, 2024
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yu-Lin CHU, Jen-Chun CHIU, Po-Hsien HO, Yu-Min HAN, Meng-Hsin CHEN, Chih-Hsiang LIN
  • Publication number: 20240152800
    Abstract: An electronic device and a method for determining scenario data of a self-driving car are provided. The method includes: obtaining training scenario data by using scenario data, a loss function and a self-driving program module; training an encoding module and a decoding module by using the training scenario data, and generating a scenario space by using the trained encoding module; obtaining a monitoring module by using the scenario space; and executing the monitoring module to determine whether current scenario data belongs to an operational design domain by using the current scenario data and the trained encoding module.
    Type: Application
    Filed: December 23, 2022
    Publication date: May 9, 2024
    Applicant: Industrial Technology Research Institute
    Inventors: Hsiu-Wei Hsu, Chen-Hui Hu
  • Publication number: 20240152649
    Abstract: The disclosure provides a data privacy protection method, a server device, and a client device for federated learning. A public dataset is used to perform model training on a machine learning model by a server device to generate a gradient pool including multiple first gradients. The gradient pool and the machine learning model are received by a client device. The client device uses a local dataset to perform model training on the machine learning model to obtain a second gradient. A local gradient is selected from the first gradients in the gradient pool according to the second gradient using a differential privacy algorithm by the client device. An aggregated machine learning model is generated by performing model aggregation based on the local gradient by the server device.
    Type: Application
    Filed: December 8, 2022
    Publication date: May 9, 2024
    Applicant: Industrial Technology Research Institute
    Inventors: Ming-Chih Kao, Pang-Chieh Wang, Chia Mu Yu, Kang Cheng Chen
  • Publication number: 20240154008
    Abstract: Provided is a semiconductor device including a substrate, a channel layer, a gate structure, a first doped region, a second doped region, a third doped region and a channel cap layer. The channel layer is located on the substrate. The channel layer has a trench. The gate structure is disposed in the trench. The first doped region and the second doped region are located in the channel layer on two sides of the gate structure. The third doped region is located in the substrate below the channel layer. The channel cap layer is located between the gate structure and the first doped region, between the gate structure and the second doped region, and between the gate structure and the channel layer. An energy band gap of the channel cap layer is larger than an energy band gap of the channel layer.
    Type: Application
    Filed: January 9, 2023
    Publication date: May 9, 2024
    Applicant: Industrial Technology Research Institute
    Inventors: Chih-Hung Yen, Yu-Ting Chen, Hua-Mao Chen