Patents Assigned to Industrial Techology Research Institute
  • Patent number: 10134963
    Abstract: A package structure of an ultraviolet light emitting diode is provided, which includes a substrate, a transparent body, at least one ultraviolet light emitting diode, a connecting element and an ultraviolet shielding layer. The transparent body is disposed on the substrate. The transparent body has a space inside thereof. The at least one ultraviolet light emitting diode is disposed on the substrate and inside the space. The connecting element is disposed between the substrate and the transparent body. The ultraviolet shielding layer is disposed between the transparent body and the connecting element.
    Type: Grant
    Filed: October 11, 2016
    Date of Patent: November 20, 2018
    Assignee: Industrial Techology Research Institute
    Inventors: Chien-Chun Lu, Chen-Peng Hsu, Zhi-Wei Koh, Yen-Hsiang Fang