Patents Assigned to Industry-Academic Co-Operation Foundation, Yonsei Unversity
  • Publication number: 20100283113
    Abstract: A wafer-scale array of optical packages and a method for fabricating the same. The wafer-scale array of optical packages includes at least one wafer-scale array of lens structures, including a wafer-scale array of first barrel structures and a wafer-scale array of lenses directly formed on the wafer-scale array of first barrel structures such that the wafer-scale array of lenses is integrally combined with the wafer-scale array of first barrel structures, the wafer-scale array of first barrel structures being made of a material different from a material of the lens of the wafer-scale array of lenses; and at least one wafer-scale array of second barrel structures stacked on and combined with the at least one wafer-scale array of lens structures.
    Type: Application
    Filed: January 12, 2009
    Publication date: November 11, 2010
    Applicant: Industry-Academic Co-Operation Foundation, Yonsei Unversity
    Inventors: Shinill Kang, Ji Seok Lim, Min Seok Choi, Ho Kwan Kim