Abstract: According to an embodiment of the present invention, there is provided a radome, including a cover part configured to cover a printed circuit board (PCB) on which a plurality of antenna arrays and an integrated circuit (IC) chip connected to the plurality of antenna arrays are formed, and a plurality of projection parts on an inner side of the cover part opposite to the PCB.
Type:
Grant
Filed:
August 2, 2016
Date of Patent:
September 15, 2020
Assignees:
LG INNOTEK CO., LTD., INDUSTRY FOUNDATION OF SOGANG UNIVERSITY
Inventors:
Cheol Bok Kim, Haeng Seon Lee, Jeong Hoon Cho
Abstract: According to an embodiment of the present invention, there is provided a radome, including a cover part configured to cover a printed circuit board (PCB) on which a plurality of antenna arrays and an integrated circuit (IC) chip connected to the plurality of antenna arrays are formed, and a plurality of projection parts on an inner side of the cover part opposite to the PCB.
Type:
Application
Filed:
August 2, 2016
Publication date:
August 16, 2018
Applicants:
LG INNOTEK CO., LTD., INDUSTRY FOUNDATION OF SOGANG UNIVERSITY
Inventors:
Cheol Bok KIM, Haeng Seon LEE, Jeong Hoon CHO