Abstract: A microcontroller and a memory having a large storage capacity are arranged in a module having a thickness of a smart card and lateral dimensions reduced in comparison therewith, and also has first connection pads (as used for smart cards) and second connection pads consistent with an extended functionality provided for a MultiMediaCard or 9-pin SD, for example. The module is personalized with an apparatus provided for smart cards and is used in a housing for a standardized memory card.