Patents Assigned to Infineion AG
  • Stabilization of slurry used in chemical mechanical polishing of semiconductor wafers by adjustment of PH of deionized water
    Patent number: 6130163
    Abstract: A method of reducing agglomerated particles in a slurry for use in a chemical mechanical polishing (CMP) machine, the CMP machine also using deionized water, is disclosed. The method comprises the steps of: monitoring the pH of the slurry that is provided to the CMP machine; monitoring the pH of the deionized water that is provided to the CMP machine; and adjusting the pH of the deionized water to be substantially the same as the pH of the slurry.
    Type: Grant
    Filed: June 3, 1999
    Date of Patent: October 10, 2000
    Assignees: ProMOS Technologies, Inc., Mosel Vitelic, Inc., Infineion AG
    Inventors: Champion Yi, Ching-feng Tsai, Jiun-Fang Wang