Abstract: Embodiments of the present invention provide a method of forming a conductive stud contacting a semiconductor device. The method includes forming a protective layer covering the semiconductor device; selectively etching an opening down through the protective layer reaching a contact area of the semiconductor device, the opening being away from a protected area of the semiconductor device; and filling the opening with a conductive material to form the conductive stud. One embodiment may further include forming a dielectric liner directly on top of the semiconductor device, and forming the protective layer on top of the dielectric liner. Embodiments of the present invention also provide a semiconductor device made thereof.

Abstract: A memory cell array includes memory cells, bit lines running along a first direction, word lines running along a second direction perpendicular to the first direction, and continuous active area lines, wherein transistors are at least partially formed in the active area lines. The transistors electrically couple corresponding memory cells to corresponding bit lines via bit line contacts, and the transistors are addressed by the word lines. The bit line contacts are formed in a region generally defined by an intersection of a bit line and a corresponding active area line. Neighboring bit line contacts which are connected with one active area line are connected with neighboring bit lines. Consequently, one active area line is crossed by a plurality of bit lines.

Abstract: The present invention relates to a method of making a multibit non-volatile memory and especially to a method of making a flash memory such as a fast-programmable Flash EEPROM (Electrically Erasable Programmable Read-Only Memory) device relying on hot-electron injection for programming which is particularly suited for high density low-voltage low-power applications and employs only two polysilicon layers.

Abstract: The invention includes a wafer having a poly silicon plug passing through a CP-contact. The poly silicon plug is formed from a relatively heavily doped poly silicon layer and a relatively lightly doped poly silicon layer. The relatively lightly doped poly silicon layer passes through the relatively heavily doped poly silicon layer to extend beyond the relatively heavily doped poly silicon layer towards the surface of the wafer. A barrier layer covers top and side walls of the relatively lightly doped poly silicon layer for reducing oxidation at the surface of the poly silicon plug. The wafer is fabricated by depositing a relatively heavily doped poly silicon layer in a CP-contact, depositing a relatively lightly doped poly silicon layer to pass through the relatively heavily doped poly silicon layer, and depositing a barrier layer to cover top and side walls of the relatively lightly doped poly silicon layer to reduce oxidation at the surface of the poly silicon plug.

Abstract: A memory is described having a semiconductor substrate of a first conductivity type, a first and a second junction region of a second conductivity type, whereby said first and said second junction region are part of respectively a first and a second bitline. A select gate is provided which is part of a wordline running perpendicular to said first and said second bitline. Read, write and erase functions for each cell make use of only two polysilicon layers which simplifies manufacture and each memory cell has at least two locations for storing a charge representing at least one bit.

Abstract: A method for programming a single bit nonvolatile memory cell integrated on a metal-dielectric-semiconductor technology chip. The memory cell comprises a semiconductor substrate including a source, a drain, and a channel in-between the source and the drain. The memory cell further comprises a control gate that comprises a gate electrode and a dielectric stack. The gate electrode is separated from the channel by the dielectric stack. Further, the dielectric stack comprises at least one charge storage dielectric layer. The method for programming the memory cell comprises applying electrical ground to the source, applying a first voltage having a first polarity to the drain, applying a second voltage of the first polarity to the control gate; and applying a third voltage having a second polarity opposite to the first polarity to the semiconductor substrate.

Abstract: A ferroelectric capacitor encapsulation method for preventing hydrogen damage to electrodes and ferroelectric material of the capacitor. In general terms, the method for encapsulating a capacitor includes etching a bottom electrode of a capacitor to expose an underlying wafer surface. An undercut is etched between the capacitor and the wafer surface. The undercut is refilled with a barrier layer to reduce the diffusion of hydrogen from the surface of the wafer into the capacitor.

Abstract: A method for manufacturing a magnetoresistive random access memory (MRAM) cell is disclosed, which alleviates the problem of Neel coupling caused by roughness in the interface between the tunnel junction layer and the magnetic layers. The method includes depositing first and second barrier layers on the conductor, wherein the first barrier layer has a polish rate different from that of the second barrier layer. The second barrier layer is then essentially removed by chemical mechanical polishing (CMP), leaving a very smooth and uniform first barrier layer. When the magnetic stack is then formed on the polished first barrier layer, interfacial roughness is not translated to the tunnel junction layer, and no corruption of magnetization is experienced.

Abstract: The invention relates to a high-voltage semiconductor component comprising semiconductor areas (4, 5) of alternating, different conductivity types which are arranged in a semiconductor body in an alternating manner.

Abstract: According to the present invention, a method for very fast calculation of the earliest command issue time for a new command issued by a memory controller is disclosed. The memory controller includes N page status registers each of which includes four page timers such that each of the page timers store a period of time between a last issued command to the particular page and a predicted next access to the memory, wherein the next access to the same page can be “close”, “open”, “write” or “read”. An incoming new command is received and it is then determined how long a particularly page access has to wait before the issue. An appropriate contents of a command timing lookup table is selected by the new command. A new time value is written into appropriate page timers that has to be inserted between the new command and a possible next access to the same page.

Abstract: A method for fabricating a structure on an integrated circuit wafer, includes applying an anti-sticking coating to a surface of a mold, depositing a first material on the anti-sticking coating, and removing a portion of the first material to expose the anti-sticking coating. A first interface between the mold and the first material has a first adhesiveness. The process also includes placing the anti-sticking coating in contact with the wafer, and removing the mold from the wafer. A second interface between the first material and the wafer has a second adhesiveness that is greater than the first adhesiveness.

Abstract: A method of forming metal lines is disclosed. The method comprises the steps of: forming a composite metal layer over a wafer, the composite metal layer having a top layer of titanium/titanium nitride; oxidizing the top layer of titanium/titanium nitride to form a layer of titanium oxide; and patterning and etching the composite metal layer to form the metal lines.